POLYAMIDE RESIN COMPOSITION
Polyamide resin compsn. having good impact resistance to lower temp. specially below 0 deg.C, comprises: 5-15 wt.% of ethylene-propylene-diene-rubber to be surface-treated with maleic acid anhydride, phthalic acid anhydride or mixt. of them; 10-30 wt.% of glass-reinforced fiber; and 55-85 wt.% of ny...
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| creator | SONG, KUM - SU HA, JAE - HYON |
| description | Polyamide resin compsn. having good impact resistance to lower temp. specially below 0 deg.C, comprises: 5-15 wt.% of ethylene-propylene-diene-rubber to be surface-treated with maleic acid anhydride, phthalic acid anhydride or mixt. of them; 10-30 wt.% of glass-reinforced fiber; and 55-85 wt.% of nylon 6. The ethylene-propylene-diene-rubber is the copolymer contg. 50-70 wt.% of ethylene and 23-47 wt.% of propylene, and contains 3-7 wt.% of double bond, and is surface-treated with 0.3-0.9 wt.% of maleic acid, phthalic acid anhydride or mixt. thereof. The obtd. resin compsn. has improved notch sensitivity, crack resistance, heat deforming resistance and stiffness. |
| format | Patent |
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The ethylene-propylene-diene-rubber is the copolymer contg. 50-70 wt.% of ethylene and 23-47 wt.% of propylene, and contains 3-7 wt.% of double bond, and is surface-treated with 0.3-0.9 wt.% of maleic acid, phthalic acid anhydride or mixt. thereof. The obtd. resin compsn. has improved notch sensitivity, crack resistance, heat deforming resistance and stiffness.</description><edition>5</edition><language>eng ; kor</language><subject>CHEMISTRY ; COMPOSITIONS BASED THEREON ; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ; METALLURGY ; ORGANIC MACROMOLECULAR COMPOUNDS ; THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><creationdate>1994</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19940720&DB=EPODOC&CC=KR&NR=940006474B1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19940720&DB=EPODOC&CC=KR&NR=940006474B1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>SONG, KUM - SU</creatorcontrib><creatorcontrib>HA, JAE - HYON</creatorcontrib><title>POLYAMIDE RESIN COMPOSITION</title><description>Polyamide resin compsn. having good impact resistance to lower temp. specially below 0 deg.C, comprises: 5-15 wt.% of ethylene-propylene-diene-rubber to be surface-treated with maleic acid anhydride, phthalic acid anhydride or mixt. of them; 10-30 wt.% of glass-reinforced fiber; and 55-85 wt.% of nylon 6. The ethylene-propylene-diene-rubber is the copolymer contg. 50-70 wt.% of ethylene and 23-47 wt.% of propylene, and contains 3-7 wt.% of double bond, and is surface-treated with 0.3-0.9 wt.% of maleic acid, phthalic acid anhydride or mixt. thereof. The obtd. resin compsn. has improved notch sensitivity, crack resistance, heat deforming resistance and stiffness.</description><subject>CHEMISTRY</subject><subject>COMPOSITIONS BASED THEREON</subject><subject>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</subject><subject>METALLURGY</subject><subject>ORGANIC MACROMOLECULAR COMPOUNDS</subject><subject>THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>1994</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZJAO8PeJdPT1dHFVCHIN9vRTcPb3DfAP9gzx9PfjYWBNS8wpTuWF0twMym6uIc4euqkF-fGpxQWJyal5qSXx3kGWJgYGBmYm5iZOTobGxKkCAOyCIcM</recordid><startdate>19940720</startdate><enddate>19940720</enddate><creator>SONG, KUM - SU</creator><creator>HA, JAE - HYON</creator><scope>EVB</scope></search><sort><creationdate>19940720</creationdate><title>POLYAMIDE RESIN COMPOSITION</title><author>SONG, KUM - SU ; HA, JAE - HYON</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_KR940006474BB13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; kor</language><creationdate>1994</creationdate><topic>CHEMISTRY</topic><topic>COMPOSITIONS BASED THEREON</topic><topic>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</topic><topic>METALLURGY</topic><topic>ORGANIC MACROMOLECULAR COMPOUNDS</topic><topic>THEIR PREPARATION OR CHEMICAL WORKING-UP</topic><toplevel>online_resources</toplevel><creatorcontrib>SONG, KUM - SU</creatorcontrib><creatorcontrib>HA, JAE - HYON</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>SONG, KUM - SU</au><au>HA, JAE - HYON</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>POLYAMIDE RESIN COMPOSITION</title><date>1994-07-20</date><risdate>1994</risdate><abstract>Polyamide resin compsn. having good impact resistance to lower temp. specially below 0 deg.C, comprises: 5-15 wt.% of ethylene-propylene-diene-rubber to be surface-treated with maleic acid anhydride, phthalic acid anhydride or mixt. of them; 10-30 wt.% of glass-reinforced fiber; and 55-85 wt.% of nylon 6. The ethylene-propylene-diene-rubber is the copolymer contg. 50-70 wt.% of ethylene and 23-47 wt.% of propylene, and contains 3-7 wt.% of double bond, and is surface-treated with 0.3-0.9 wt.% of maleic acid, phthalic acid anhydride or mixt. thereof. The obtd. resin compsn. has improved notch sensitivity, crack resistance, heat deforming resistance and stiffness.</abstract><edition>5</edition><oa>free_for_read</oa></addata></record> |
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| language | eng ; kor |
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| subjects | CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP |
| title | POLYAMIDE RESIN COMPOSITION |
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