POLYAMIDE RESIN COMPOSITION

Polyamide resin compsn. having good impact resistance to lower temp. specially below 0 deg.C, comprises: 5-15 wt.% of ethylene-propylene-diene-rubber to be surface-treated with maleic acid anhydride, phthalic acid anhydride or mixt. of them; 10-30 wt.% of glass-reinforced fiber; and 55-85 wt.% of ny...

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Bibliographische Detailangaben
Hauptverfasser:	SONG, KUM - SU, HA, JAE - HYON
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP
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Beschreibung
Zusammenfassung:	Polyamide resin compsn. having good impact resistance to lower temp. specially below 0 deg.C, comprises: 5-15 wt.% of ethylene-propylene-diene-rubber to be surface-treated with maleic acid anhydride, phthalic acid anhydride or mixt. of them; 10-30 wt.% of glass-reinforced fiber; and 55-85 wt.% of nylon 6. The ethylene-propylene-diene-rubber is the copolymer contg. 50-70 wt.% of ethylene and 23-47 wt.% of propylene, and contains 3-7 wt.% of double bond, and is surface-treated with 0.3-0.9 wt.% of maleic acid, phthalic acid anhydride or mixt. thereof. The obtd. resin compsn. has improved notch sensitivity, crack resistance, heat deforming resistance and stiffness.