ELECTRONIC CIRCUIT DEVICE

Disclosed is an electronic circuit device in which the solder (14) connecting lead pins (6) to the ceramic substrate (2) has a melting point of 356 DEG C. to 450 DEG C. and has a tensile strength being low in such an extent that a thermal contraction stress generated in a cooling process of the sold...

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Bibliographische Detailangaben
Hauptverfasser:	AMEYA, DOSHINORI, WATANABE, HIDEKI, DAKENAKA, DAKAJI, SATO, RYOHEI, HIROTA, GAZUO, OOTA, DOSHIHIKO
Format:	Patent
Sprache:	eng
Schlagworte:	ARTIFICIAL STONE BASIC ELECTRIC ELEMENTS CEMENTS CERAMICS CHEMISTRY CLADDING OR PLATING BY SOLDERING OR WELDING COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDINGMATERIALS CONCRETE CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY LIME, MAGNESIA MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR METALLURGY PERFORMING OPERATIONS REFRACTORIES SEMICONDUCTOR DEVICES SLAG SOLDERING OR UNSOLDERING TRANSPORTING TREATMENT OF NATURAL STONE WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	Disclosed is an electronic circuit device in which the solder (14) connecting lead pins (6) to the ceramic substrate (2) has a melting point of 356 DEG C. to 450 DEG C. and has a tensile strength being low in such an extent that a thermal contraction stress generated in a cooling process of the solder (14) from the melting point thereof is low and the substrate (2) does not break. The solder (14) is a Au-Ge alloy containing 10-15 wt % of Ge. Electronic circuit devices, which employ the above solder (14) in the connections, are free from damages in the ceramic wiring substrate (2) due to the bonding. Further, when the electronic circuit device undergoes a series of assembly processes after the above bonding, such solder (14) does not melt, and wettability of such solder (14) is favorable.