LOW TEMPERATURE CERAMICS
The low temperature ceramics are prepared by sintering a porcelain compsn. at the low temperature 900-1000 deg.C. The porcelain compsn. consists of 55-75 wt.% glass powder and 45-25 wt.% Al2O3 powder. The glass powder comprises 5-28 wt.% CaO, 0-15 wt.% Al2O3, 5-15 wt.% BaO, 40-50 wt.% SiO2, 5-10 wt....
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creator | CHANG SONG-DO JOO KI-TAE SON YONG-BAE KIM JONG-DON |
description | The low temperature ceramics are prepared by sintering a porcelain compsn. at the low temperature 900-1000 deg.C. The porcelain compsn. consists of 55-75 wt.% glass powder and 45-25 wt.% Al2O3 powder. The glass powder comprises 5-28 wt.% CaO, 0-15 wt.% Al2O3, 5-15 wt.% BaO, 40-50 wt.% SiO2, 5-10 wt.% ZnO, 2-25 wt.% B2O3 and at most 10 wt.% metal oxide. The ceramics are used as a glass- ceramic type circuit board material, and has a good water-resistance and strength. |
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The porcelain compsn. consists of 55-75 wt.% glass powder and 45-25 wt.% Al2O3 powder. The glass powder comprises 5-28 wt.% CaO, 0-15 wt.% Al2O3, 5-15 wt.% BaO, 40-50 wt.% SiO2, 5-10 wt.% ZnO, 2-25 wt.% B2O3 and at most 10 wt.% metal oxide. 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subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS |
title | LOW TEMPERATURE CERAMICS |
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