LOW TEMPERATURE CERAMICS

LOW TEMPERATURE CERAMICS

The low temperature ceramics are prepared by sintering a porcelain compsn. at the low temperature 900-1000 deg.C. The porcelain compsn. consists of 55-75 wt.% glass powder and 45-25 wt.% Al2O3 powder. The glass powder comprises 5-28 wt.% CaO, 0-15 wt.% Al2O3, 5-15 wt.% BaO, 40-50 wt.% SiO2, 5-10 wt....

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Bibliographische Detailangaben
Hauptverfasser: CHANG SONG-DO, JOO KI-TAE, SON YONG-BAE, KIM JONG-DON
Format: Patent
Sprache:eng
Schlagworte:
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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Beschreibung
Zusammenfassung:The low temperature ceramics are prepared by sintering a porcelain compsn. at the low temperature 900-1000 deg.C. The porcelain compsn. consists of 55-75 wt.% glass powder and 45-25 wt.% Al2O3 powder. The glass powder comprises 5-28 wt.% CaO, 0-15 wt.% Al2O3, 5-15 wt.% BaO, 40-50 wt.% SiO2, 5-10 wt.% ZnO, 2-25 wt.% B2O3 and at most 10 wt.% metal oxide. The ceramics are used as a glass- ceramic type circuit board material, and has a good water-resistance and strength.