IMPROVED ELECTRICALLY-CONDUCTIVE RESIN COMPOSITION

An electroconductive resin composition suitable for direct electroplating comprises (a) 100 parts by wt. of a polyolefin resin, (b) 0.1 - 10 parts by wt. of sulfur, (c) 0.05 - 10 parts by wt. of a plate adhesion promoter, and (d) 10 - 70 parts by wt. of an electroconductive carbon black. The composi...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	YOKOTE, SATZIO, SEKIKUCHI, KASSUMI, KOTO, YOSHIHISA, KAWAI, YOICHI, MAKI, MASAMI
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS THEREFOR CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	An electroconductive resin composition suitable for direct electroplating comprises (a) 100 parts by wt. of a polyolefin resin, (b) 0.1 - 10 parts by wt. of sulfur, (c) 0.05 - 10 parts by wt. of a plate adhesion promoter, and (d) 10 - 70 parts by wt. of an electroconductive carbon black. The composition further comprises a flow improver in an amount of 4 - 40 parts by wt. per 100 parts by wt. of the combination of the polyolefin resin and the electroconductive carbon black. The flow improver is selected from softening agents derived from petroleum, polyalkylene glycols, and their mixtures.