METHOD OF MAKING A LEAD FRAME

This invention offer a method of manufacturing a lead frame which positions the wire chip flatly and maintains a regular distance between wires. In manufatturing a lead frame a lead frame blank which has a number of lead attached to a pad from both sides and arranged regularly is plated, when one le...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser:	WIN C
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	This invention offer a method of manufacturing a lead frame which positions the wire chip flatly and maintains a regular distance between wires. In manufatturing a lead frame a lead frame blank which has a number of lead attached to a pad from both sides and arranged regularly is plated, when one lead is separated from a pad, tape which can indure high temperature is used for fixing the position of the lead.