THE CONTACT METHOD OF THIN FILM CIRCUIT

THE CONTACT METHOD OF THIN FILM CIRCUIT

After resistance layer(10), conductor layers(11) and protection films(12) are attached to the upper of the substance for thin film, the thin film circuit is made and conductor layers, for example Al layers(9), are interposed between substance for thin film(8) and a part of resistance layers. In sold...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: YOSIMI KAMI JO, HIROYUKI ITO, NIKI SYUJI, KYOTO ABE
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:After resistance layer(10), conductor layers(11) and protection films(12) are attached to the upper of the substance for thin film, the thin film circuit is made and conductor layers, for example Al layers(9), are interposed between substance for thin film(8) and a part of resistance layers. In soldering, the interposed Al layers make the resistance layers(10) very thin and the defect(15) in the conductor layers(11) is made short.