하이브리드 본딩 절연막 형성 재료, 반도체 장치의 제조 방법, 및 반도체 장치

(A) 중합성의 불포화 결합 부위를 갖는 폴리이미드 전구체와, (B) 용제와, (C) 옥심계 광중합 개시제를 포함하는 하이브리드 본딩 절연막 형성 재료. This hybrid bonding insulation film-forming material comprises: (A) a polyimide precursor having a polymerizable unsaturated bond site; (B) a solvent; and (C) an oxime-based photopolymerization initiator....

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Bibliographische Detailangaben
Hauptverfasser:	KOBAYASHI KAORI, YONEDA SATOSHI, MATSUKAWA DAISAKU, ADACHI KENYA
Format:	Patent
Sprache:	kor
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	(A) 중합성의 불포화 결합 부위를 갖는 폴리이미드 전구체와, (B) 용제와, (C) 옥심계 광중합 개시제를 포함하는 하이브리드 본딩 절연막 형성 재료. This hybrid bonding insulation film-forming material comprises: (A) a polyimide precursor having a polymerizable unsaturated bond site; (B) a solvent; and (C) an oxime-based photopolymerization initiator.