수지 조성물, 절연성 수지 경화체, 적층체 및 회로 기판
수지 조성물은, 열경화성 수지와, 무기 충전재와, 공중합체와, 무기 이온 포착제를 함유하고, 공중합체가, 음이온성기를 갖는 (메트)아크릴계 단량체 단위 A와, 양이온성기를 갖는 (메트)아크릴계 단량체 단위 B와, (메트)아크릴계 단량체 단위 A 및 (메트)아크릴계 단량체 단위 B 이외의 (메트)아크릴계 단량체 단위 C를 갖고, 무기 이온 포착제가, 음이온 교환체 및 양이온 교환체의 양쪽, 또는 양쪽 이온 교환체를 포함하고, 무기 이온 포착제의 함유량이, 열경화성 수지 및 공중합체의 합계 100질량부에 대하여 0.1 내지 50질량부이...
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| creator | NEBASHI IBUKI ICHIKAWA ISAMU NAKAZAWA TOMOHIRO KOGURE KATSUMICHI GONDA YUHEI KUMAGAI RYOTA |
| description | 수지 조성물은, 열경화성 수지와, 무기 충전재와, 공중합체와, 무기 이온 포착제를 함유하고, 공중합체가, 음이온성기를 갖는 (메트)아크릴계 단량체 단위 A와, 양이온성기를 갖는 (메트)아크릴계 단량체 단위 B와, (메트)아크릴계 단량체 단위 A 및 (메트)아크릴계 단량체 단위 B 이외의 (메트)아크릴계 단량체 단위 C를 갖고, 무기 이온 포착제가, 음이온 교환체 및 양이온 교환체의 양쪽, 또는 양쪽 이온 교환체를 포함하고, 무기 이온 포착제의 함유량이, 열경화성 수지 및 공중합체의 합계 100질량부에 대하여 0.1 내지 50질량부이고, 공중합체의 함유량이, 무기 충전재 100질량부에 대하여 0.01 내지 10질량부이다.
A resin composition containing a thermosetting resin, an inorganic filler, a copolymer, and an inorganic ion scavenger, wherein the copolymer has a (meth)acrylic monomer unit A having an anionic group, a (meth)acrylic monomer unit B having a cationic group, and a (meth) acrylic monomer unit C other than the (meth)acrylic monomer unit A and the (meth)acrylic monomer unit B, the inorganic ion scavenger comprises both an anion exchanger and a cation exchanger, or an amphoteric ion exchanger, the content of the inorganic ion scavenger is 0.1-50 parts by mass per 100 parts by mass of the total of the thermosetting resin and the copolymer, and the content of the copolymer is 0.01-10 parts by mass per 100 parts by mass of the inorganic filler. |
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A resin composition containing a thermosetting resin, an inorganic filler, a copolymer, and an inorganic ion scavenger, wherein the copolymer has a (meth)acrylic monomer unit A having an anionic group, a (meth)acrylic monomer unit B having a cationic group, and a (meth) acrylic monomer unit C other than the (meth)acrylic monomer unit A and the (meth)acrylic monomer unit B, the inorganic ion scavenger comprises both an anion exchanger and a cation exchanger, or an amphoteric ion exchanger, the content of the inorganic ion scavenger is 0.1-50 parts by mass per 100 parts by mass of the total of the thermosetting resin and the copolymer, and the content of the copolymer is 0.01-10 parts by mass per 100 parts by mass of the inorganic filler.</description><language>kor</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CHEMISTRY ; COMPOSITIONS BASED THEREON ; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; LAYERED PRODUCTS ; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; METALLURGY ; ORGANIC MACROMOLECULAR COMPOUNDS ; PERFORMING OPERATIONS ; PRINTED CIRCUITS ; THEIR PREPARATION OR CHEMICAL WORKING-UP ; TRANSPORTING ; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20241114&DB=EPODOC&CC=KR&NR=20240162144A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25562,76317</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20241114&DB=EPODOC&CC=KR&NR=20240162144A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>NEBASHI IBUKI</creatorcontrib><creatorcontrib>ICHIKAWA ISAMU</creatorcontrib><creatorcontrib>NAKAZAWA TOMOHIRO</creatorcontrib><creatorcontrib>KOGURE KATSUMICHI</creatorcontrib><creatorcontrib>GONDA YUHEI</creatorcontrib><creatorcontrib>KUMAGAI RYOTA</creatorcontrib><title>수지 조성물, 절연성 수지 경화체, 적층체 및 회로 기판</title><description>수지 조성물은, 열경화성 수지와, 무기 충전재와, 공중합체와, 무기 이온 포착제를 함유하고, 공중합체가, 음이온성기를 갖는 (메트)아크릴계 단량체 단위 A와, 양이온성기를 갖는 (메트)아크릴계 단량체 단위 B와, (메트)아크릴계 단량체 단위 A 및 (메트)아크릴계 단량체 단위 B 이외의 (메트)아크릴계 단량체 단위 C를 갖고, 무기 이온 포착제가, 음이온 교환체 및 양이온 교환체의 양쪽, 또는 양쪽 이온 교환체를 포함하고, 무기 이온 포착제의 함유량이, 열경화성 수지 및 공중합체의 합계 100질량부에 대하여 0.1 내지 50질량부이고, 공중합체의 함유량이, 무기 충전재 100질량부에 대하여 0.01 내지 10질량부이다.
A resin composition containing a thermosetting resin, an inorganic filler, a copolymer, and an inorganic ion scavenger, wherein the copolymer has a (meth)acrylic monomer unit A having an anionic group, a (meth)acrylic monomer unit B having a cationic group, and a (meth) acrylic monomer unit C other than the (meth)acrylic monomer unit A and the (meth)acrylic monomer unit B, the inorganic ion scavenger comprises both an anion exchanger and a cation exchanger, or an amphoteric ion exchanger, the content of the inorganic ion scavenger is 0.1-50 parts by mass per 100 parts by mass of the total of the thermosetting resin and the copolymer, and the content of the copolymer is 0.01-10 parts by mass per 100 parts by mass of the inorganic filler.</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CHEMISTRY</subject><subject>COMPOSITIONS BASED THEREON</subject><subject>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>LAYERED PRODUCTS</subject><subject>LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>METALLURGY</subject><subject>ORGANIC MACROMOLECULAR COMPOUNDS</subject><subject>PERFORMING OPERATIONS</subject><subject>PRINTED CIRCUITS</subject><subject>THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><subject>TRANSPORTING</subject><subject>USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZPB80zHjzfIGhTcLN7xp2fh6zR4dhTcLOt5MB_EUoHKvNu19O3PKm01bQHKNb3ZsBTIVXm_oV3g7q-f1wjkKr3ZseNszgYeBNS0xpziVF0pzMyi7uYY4e-imFuTHpxYXJCan5qWWxHsHGRkYmRgYmhkZmpg4GhOnCgCEOUjs</recordid><startdate>20241114</startdate><enddate>20241114</enddate><creator>NEBASHI IBUKI</creator><creator>ICHIKAWA ISAMU</creator><creator>NAKAZAWA TOMOHIRO</creator><creator>KOGURE KATSUMICHI</creator><creator>GONDA YUHEI</creator><creator>KUMAGAI RYOTA</creator><scope>EVB</scope></search><sort><creationdate>20241114</creationdate><title>수지 조성물, 절연성 수지 경화체, 적층체 및 회로 기판</title><author>NEBASHI IBUKI ; ICHIKAWA ISAMU ; NAKAZAWA TOMOHIRO ; KOGURE KATSUMICHI ; GONDA YUHEI ; KUMAGAI RYOTA</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_KR20240162144A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>kor</language><creationdate>2024</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CHEMISTRY</topic><topic>COMPOSITIONS BASED THEREON</topic><topic>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>LAYERED PRODUCTS</topic><topic>LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>METALLURGY</topic><topic>ORGANIC MACROMOLECULAR COMPOUNDS</topic><topic>PERFORMING OPERATIONS</topic><topic>PRINTED CIRCUITS</topic><topic>THEIR PREPARATION OR CHEMICAL WORKING-UP</topic><topic>TRANSPORTING</topic><topic>USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS</topic><toplevel>online_resources</toplevel><creatorcontrib>NEBASHI IBUKI</creatorcontrib><creatorcontrib>ICHIKAWA ISAMU</creatorcontrib><creatorcontrib>NAKAZAWA TOMOHIRO</creatorcontrib><creatorcontrib>KOGURE KATSUMICHI</creatorcontrib><creatorcontrib>GONDA YUHEI</creatorcontrib><creatorcontrib>KUMAGAI RYOTA</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>NEBASHI IBUKI</au><au>ICHIKAWA ISAMU</au><au>NAKAZAWA TOMOHIRO</au><au>KOGURE KATSUMICHI</au><au>GONDA YUHEI</au><au>KUMAGAI RYOTA</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>수지 조성물, 절연성 수지 경화체, 적층체 및 회로 기판</title><date>2024-11-14</date><risdate>2024</risdate><abstract>수지 조성물은, 열경화성 수지와, 무기 충전재와, 공중합체와, 무기 이온 포착제를 함유하고, 공중합체가, 음이온성기를 갖는 (메트)아크릴계 단량체 단위 A와, 양이온성기를 갖는 (메트)아크릴계 단량체 단위 B와, (메트)아크릴계 단량체 단위 A 및 (메트)아크릴계 단량체 단위 B 이외의 (메트)아크릴계 단량체 단위 C를 갖고, 무기 이온 포착제가, 음이온 교환체 및 양이온 교환체의 양쪽, 또는 양쪽 이온 교환체를 포함하고, 무기 이온 포착제의 함유량이, 열경화성 수지 및 공중합체의 합계 100질량부에 대하여 0.1 내지 50질량부이고, 공중합체의 함유량이, 무기 충전재 100질량부에 대하여 0.01 내지 10질량부이다.
A resin composition containing a thermosetting resin, an inorganic filler, a copolymer, and an inorganic ion scavenger, wherein the copolymer has a (meth)acrylic monomer unit A having an anionic group, a (meth)acrylic monomer unit B having a cationic group, and a (meth) acrylic monomer unit C other than the (meth)acrylic monomer unit A and the (meth)acrylic monomer unit B, the inorganic ion scavenger comprises both an anion exchanger and a cation exchanger, or an amphoteric ion exchanger, the content of the inorganic ion scavenger is 0.1-50 parts by mass per 100 parts by mass of the total of the thermosetting resin and the copolymer, and the content of the copolymer is 0.01-10 parts by mass per 100 parts by mass of the inorganic filler.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS PRINTED CIRCUITS THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS |
| title | 수지 조성물, 절연성 수지 경화체, 적층체 및 회로 기판 |
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