THERMOPLASTIC RESIN COMPOSITION AND MOLDED ARTICLE USING THE SAME
열가소성 수지 조성물 및 이를 이용한 성형품에 관한 것이다. 일 구현예에서는 (A-1) 부타디엔계 고무 변성 방향족 비닐 화합물-시안화 비닐 화합물 그라프트 공중합체 10 내지 25 중량%; (A-2) 폴리부틸렌 테레프탈레이트 수지 20 내지 40 중량%; (A-3) 방향족 비닐 화합물-시안화 비닐 화합물 공중합체 25 내지 45 중량%; (A-4) 에폭시기 함유 (메트)아크릴레이트-방향족 비닐 화합물-시안화 비닐 화합물 공중합체 2 내지 6 중량%; 및 (A-5) α-메틸스티렌-방향족 비닐 화합물-시안화 비닐 화합물 공중합체 15...
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| creator | LEE YUJIN PARK JUNGEUN CHU DONGHUI |
| description | 열가소성 수지 조성물 및 이를 이용한 성형품에 관한 것이다. 일 구현예에서는 (A-1) 부타디엔계 고무 변성 방향족 비닐 화합물-시안화 비닐 화합물 그라프트 공중합체 10 내지 25 중량%; (A-2) 폴리부틸렌 테레프탈레이트 수지 20 내지 40 중량%; (A-3) 방향족 비닐 화합물-시안화 비닐 화합물 공중합체 25 내지 45 중량%; (A-4) 에폭시기 함유 (메트)아크릴레이트-방향족 비닐 화합물-시안화 비닐 화합물 공중합체 2 내지 6 중량%; 및 (A-5) α-메틸스티렌-방향족 비닐 화합물-시안화 비닐 화합물 공중합체 15 내지 25 중량%를 포함하는 (A) 기초 수지 100 중량부에 대해, (B) 방향족 비닐 화합물-시안화 비닐 화합물-말레산 무수물 공중합체 1 내지 5 중량부를 포함하는 열가소성 수지 조성물을 제공한다.
The present invention relates to a thermoplastic resin composition and a molded article using same. In one embodiment, provided is a thermoplastic resin composition comprising (B) 1-5 parts by weight of an aromatic vinyl compound-cyanide vinyl compound-maleic anhydride copolymer, (A) on the basis of 100 parts by weight of a base resin comprising: (A-1) 10-25% by weight of a butadiene-based rubber-modified aromatic vinyl compound-cyanide vinyl compound graft copolymer; (A-2) 20-40% by weight of a polybutylene terephthalate resin; (A-3) 25-45% by weight of an aromatic vinyl compound-cyanide vinyl compound copolymer; (A-4) 2-6% by weight of an epoxy group-containing (meth)acrylate-aromatic vinyl compound-cyanide vinyl compound copolymer; and (A-5) 15-25% by weight of an α-methylstyrene-aromatic vinyl compound-cyanide vinyl compound copolymer. |
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| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_KR20240138877A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>KR20240138877A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_KR20240138877A3</originalsourceid><addsrcrecordid>eNrjZHAM8XAN8vUP8HEMDvF0VghyDfb0U3D29w3wD_YM8fT3U3D0c1Hw9fdxcXVRcAwCKvFxVQgFqnFXAGpUCHb0deVhYE1LzClO5YXS3AzKbq4hzh66qQX58anFBYnJqXmpJfHeQUYGRiYGhsYWFubmjsbEqQIAkpYr5Q</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>THERMOPLASTIC RESIN COMPOSITION AND MOLDED ARTICLE USING THE SAME</title><source>esp@cenet</source><creator>LEE YUJIN ; PARK JUNGEUN ; CHU DONGHUI</creator><creatorcontrib>LEE YUJIN ; PARK JUNGEUN ; CHU DONGHUI</creatorcontrib><description>열가소성 수지 조성물 및 이를 이용한 성형품에 관한 것이다. 일 구현예에서는 (A-1) 부타디엔계 고무 변성 방향족 비닐 화합물-시안화 비닐 화합물 그라프트 공중합체 10 내지 25 중량%; (A-2) 폴리부틸렌 테레프탈레이트 수지 20 내지 40 중량%; (A-3) 방향족 비닐 화합물-시안화 비닐 화합물 공중합체 25 내지 45 중량%; (A-4) 에폭시기 함유 (메트)아크릴레이트-방향족 비닐 화합물-시안화 비닐 화합물 공중합체 2 내지 6 중량%; 및 (A-5) α-메틸스티렌-방향족 비닐 화합물-시안화 비닐 화합물 공중합체 15 내지 25 중량%를 포함하는 (A) 기초 수지 100 중량부에 대해, (B) 방향족 비닐 화합물-시안화 비닐 화합물-말레산 무수물 공중합체 1 내지 5 중량부를 포함하는 열가소성 수지 조성물을 제공한다.
The present invention relates to a thermoplastic resin composition and a molded article using same. In one embodiment, provided is a thermoplastic resin composition comprising (B) 1-5 parts by weight of an aromatic vinyl compound-cyanide vinyl compound-maleic anhydride copolymer, (A) on the basis of 100 parts by weight of a base resin comprising: (A-1) 10-25% by weight of a butadiene-based rubber-modified aromatic vinyl compound-cyanide vinyl compound graft copolymer; (A-2) 20-40% by weight of a polybutylene terephthalate resin; (A-3) 25-45% by weight of an aromatic vinyl compound-cyanide vinyl compound copolymer; (A-4) 2-6% by weight of an epoxy group-containing (meth)acrylate-aromatic vinyl compound-cyanide vinyl compound copolymer; and (A-5) 15-25% by weight of an α-methylstyrene-aromatic vinyl compound-cyanide vinyl compound copolymer.</description><language>eng ; kor</language><subject>CHEMISTRY ; COMPOSITIONS BASED THEREON ; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ; METALLURGY ; ORGANIC MACROMOLECULAR COMPOUNDS ; THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240920&DB=EPODOC&CC=KR&NR=20240138877A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240920&DB=EPODOC&CC=KR&NR=20240138877A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>LEE YUJIN</creatorcontrib><creatorcontrib>PARK JUNGEUN</creatorcontrib><creatorcontrib>CHU DONGHUI</creatorcontrib><title>THERMOPLASTIC RESIN COMPOSITION AND MOLDED ARTICLE USING THE SAME</title><description>열가소성 수지 조성물 및 이를 이용한 성형품에 관한 것이다. 일 구현예에서는 (A-1) 부타디엔계 고무 변성 방향족 비닐 화합물-시안화 비닐 화합물 그라프트 공중합체 10 내지 25 중량%; (A-2) 폴리부틸렌 테레프탈레이트 수지 20 내지 40 중량%; (A-3) 방향족 비닐 화합물-시안화 비닐 화합물 공중합체 25 내지 45 중량%; (A-4) 에폭시기 함유 (메트)아크릴레이트-방향족 비닐 화합물-시안화 비닐 화합물 공중합체 2 내지 6 중량%; 및 (A-5) α-메틸스티렌-방향족 비닐 화합물-시안화 비닐 화합물 공중합체 15 내지 25 중량%를 포함하는 (A) 기초 수지 100 중량부에 대해, (B) 방향족 비닐 화합물-시안화 비닐 화합물-말레산 무수물 공중합체 1 내지 5 중량부를 포함하는 열가소성 수지 조성물을 제공한다.
The present invention relates to a thermoplastic resin composition and a molded article using same. In one embodiment, provided is a thermoplastic resin composition comprising (B) 1-5 parts by weight of an aromatic vinyl compound-cyanide vinyl compound-maleic anhydride copolymer, (A) on the basis of 100 parts by weight of a base resin comprising: (A-1) 10-25% by weight of a butadiene-based rubber-modified aromatic vinyl compound-cyanide vinyl compound graft copolymer; (A-2) 20-40% by weight of a polybutylene terephthalate resin; (A-3) 25-45% by weight of an aromatic vinyl compound-cyanide vinyl compound copolymer; (A-4) 2-6% by weight of an epoxy group-containing (meth)acrylate-aromatic vinyl compound-cyanide vinyl compound copolymer; and (A-5) 15-25% by weight of an α-methylstyrene-aromatic vinyl compound-cyanide vinyl compound copolymer.</description><subject>CHEMISTRY</subject><subject>COMPOSITIONS BASED THEREON</subject><subject>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</subject><subject>METALLURGY</subject><subject>ORGANIC MACROMOLECULAR COMPOUNDS</subject><subject>THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZHAM8XAN8vUP8HEMDvF0VghyDfb0U3D29w3wD_YM8fT3U3D0c1Hw9fdxcXVRcAwCKvFxVQgFqnFXAGpUCHb0deVhYE1LzClO5YXS3AzKbq4hzh66qQX58anFBYnJqXmpJfHeQUYGRiYGhsYWFubmjsbEqQIAkpYr5Q</recordid><startdate>20240920</startdate><enddate>20240920</enddate><creator>LEE YUJIN</creator><creator>PARK JUNGEUN</creator><creator>CHU DONGHUI</creator><scope>EVB</scope></search><sort><creationdate>20240920</creationdate><title>THERMOPLASTIC RESIN COMPOSITION AND MOLDED ARTICLE USING THE SAME</title><author>LEE YUJIN ; PARK JUNGEUN ; CHU DONGHUI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_KR20240138877A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; kor</language><creationdate>2024</creationdate><topic>CHEMISTRY</topic><topic>COMPOSITIONS BASED THEREON</topic><topic>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</topic><topic>METALLURGY</topic><topic>ORGANIC MACROMOLECULAR COMPOUNDS</topic><topic>THEIR PREPARATION OR CHEMICAL WORKING-UP</topic><toplevel>online_resources</toplevel><creatorcontrib>LEE YUJIN</creatorcontrib><creatorcontrib>PARK JUNGEUN</creatorcontrib><creatorcontrib>CHU DONGHUI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>LEE YUJIN</au><au>PARK JUNGEUN</au><au>CHU DONGHUI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>THERMOPLASTIC RESIN COMPOSITION AND MOLDED ARTICLE USING THE SAME</title><date>2024-09-20</date><risdate>2024</risdate><abstract>열가소성 수지 조성물 및 이를 이용한 성형품에 관한 것이다. 일 구현예에서는 (A-1) 부타디엔계 고무 변성 방향족 비닐 화합물-시안화 비닐 화합물 그라프트 공중합체 10 내지 25 중량%; (A-2) 폴리부틸렌 테레프탈레이트 수지 20 내지 40 중량%; (A-3) 방향족 비닐 화합물-시안화 비닐 화합물 공중합체 25 내지 45 중량%; (A-4) 에폭시기 함유 (메트)아크릴레이트-방향족 비닐 화합물-시안화 비닐 화합물 공중합체 2 내지 6 중량%; 및 (A-5) α-메틸스티렌-방향족 비닐 화합물-시안화 비닐 화합물 공중합체 15 내지 25 중량%를 포함하는 (A) 기초 수지 100 중량부에 대해, (B) 방향족 비닐 화합물-시안화 비닐 화합물-말레산 무수물 공중합체 1 내지 5 중량부를 포함하는 열가소성 수지 조성물을 제공한다.
The present invention relates to a thermoplastic resin composition and a molded article using same. In one embodiment, provided is a thermoplastic resin composition comprising (B) 1-5 parts by weight of an aromatic vinyl compound-cyanide vinyl compound-maleic anhydride copolymer, (A) on the basis of 100 parts by weight of a base resin comprising: (A-1) 10-25% by weight of a butadiene-based rubber-modified aromatic vinyl compound-cyanide vinyl compound graft copolymer; (A-2) 20-40% by weight of a polybutylene terephthalate resin; (A-3) 25-45% by weight of an aromatic vinyl compound-cyanide vinyl compound copolymer; (A-4) 2-6% by weight of an epoxy group-containing (meth)acrylate-aromatic vinyl compound-cyanide vinyl compound copolymer; and (A-5) 15-25% by weight of an α-methylstyrene-aromatic vinyl compound-cyanide vinyl compound copolymer.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP |
| title | THERMOPLASTIC RESIN COMPOSITION AND MOLDED ARTICLE USING THE SAME |
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