FLAME RETARDANT ADHESIVE COMPOSITION AND CEILING BOARD COMPRISING THE SAME

본 발명은 고형분 총 중량을 기준으로 20 내지 50 중량%의 콜로이달 실리카, 5 내지 20 중량%의 폴리비닐알코올, 20 내지 50 중량%의 무기 난연제 및 0.1 내지 10 중량%의 커플링제를 포함하는 난연 접착제 조성물, 및 이를 포함하는 불연성을 갖는 천장재에 관한 것이다. The present invention relates to: a flame retardant adhesive composition comprising 20 to 50 wt% of colloidal silica, 5 to 20 wt% of polyviny...

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Bibliographische Detailangaben
Hauptverfasser:	CHAE MINSUNG, LIM TAEWOOK, CHOI, PARK, LEE, KANG HYEJIN, KIM YUBAE
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY COMPOSITIONS BASED THEREON DYES LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS PERFORMING OPERATIONS POLISHES THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	본 발명은 고형분 총 중량을 기준으로 20 내지 50 중량%의 콜로이달 실리카, 5 내지 20 중량%의 폴리비닐알코올, 20 내지 50 중량%의 무기 난연제 및 0.1 내지 10 중량%의 커플링제를 포함하는 난연 접착제 조성물, 및 이를 포함하는 불연성을 갖는 천장재에 관한 것이다. The present invention relates to: a flame retardant adhesive composition comprising 20 to 50 wt% of colloidal silica, 5 to 20 wt% of polyvinyl alcohol, 20 to 50 wt% of an inorganic flame retardant, and 0.1 to 10 wt% of a coupling agent, based on the total weight of the solid content; and a non-combustible ceiling board comprising same.