수용성 플럭스 및 솔더 페이스트
보이드의 발생을 보다 억제할 수 있는 수용성 플럭스는, 융점이 40℃ 이하인 케토산과, 비점이 240℃ 이하인 용제를 함유한다. This water-soluble flux capable of further suppressing the occurrence of voids contains a keto acid having a melting point of 40° C. or lower and a solvent having a boiling point of 240° C. or lower....
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creator | YAMADA YO YAMAGAME TOMOHIRO |
description | 보이드의 발생을 보다 억제할 수 있는 수용성 플럭스는, 융점이 40℃ 이하인 케토산과, 비점이 240℃ 이하인 용제를 함유한다.
This water-soluble flux capable of further suppressing the occurrence of voids contains a keto acid having a melting point of 40° C. or lower and a solvent having a boiling point of 240° C. or lower. |
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This water-soluble flux capable of further suppressing the occurrence of voids contains a keto acid having a melting point of 40° C. or lower and a solvent having a boiling point of 240° C. or lower.</description><language>kor</language><subject>CLADDING OR PLATING BY SOLDERING OR WELDING ; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ; MACHINE TOOLS ; METAL-WORKING NOT OTHERWISE PROVIDED FOR ; PERFORMING OPERATIONS ; SOLDERING OR UNSOLDERING ; TRANSPORTING ; WELDING ; WORKING BY LASER BEAM</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240705&DB=EPODOC&CC=KR&NR=20240105383A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240705&DB=EPODOC&CC=KR&NR=20240105383A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>YAMADA YO</creatorcontrib><creatorcontrib>YAMAGAME TOMOHIRO</creatorcontrib><title>수용성 플럭스 및 솔더 페이스트</title><description>보이드의 발생을 보다 억제할 수 있는 수용성 플럭스는, 융점이 40℃ 이하인 케토산과, 비점이 240℃ 이하인 용제를 함유한다.
This water-soluble flux capable of further suppressing the occurrence of voids contains a keto acid having a melting point of 40° C. or lower and a solvent having a boiling point of 240° C. or lower.</description><subject>CLADDING OR PLATING BY SOLDERING OR WELDING</subject><subject>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</subject><subject>MACHINE TOOLS</subject><subject>METAL-WORKING NOT OTHERWISE PROVIDED FOR</subject><subject>PERFORMING OPERATIONS</subject><subject>SOLDERING OR UNSOLDERING</subject><subject>TRANSPORTING</subject><subject>WELDING</subject><subject>WORKING BY LASER BEAM</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZNB-0zHjzayVb1o2Kryd0vN6_to3XUsUXm_oV3jTNuV17xSFt30z3szdAhR827WDh4E1LTGnOJUXSnMzKLu5hjh76KYW5MenFhckJqfmpZbEewcZGRiZGBgamBpbGDsaE6cKAD_UNfU</recordid><startdate>20240705</startdate><enddate>20240705</enddate><creator>YAMADA YO</creator><creator>YAMAGAME TOMOHIRO</creator><scope>EVB</scope></search><sort><creationdate>20240705</creationdate><title>수용성 플럭스 및 솔더 페이스트</title><author>YAMADA YO ; YAMAGAME TOMOHIRO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_KR20240105383A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>kor</language><creationdate>2024</creationdate><topic>CLADDING OR PLATING BY SOLDERING OR WELDING</topic><topic>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</topic><topic>MACHINE TOOLS</topic><topic>METAL-WORKING NOT OTHERWISE PROVIDED FOR</topic><topic>PERFORMING OPERATIONS</topic><topic>SOLDERING OR UNSOLDERING</topic><topic>TRANSPORTING</topic><topic>WELDING</topic><topic>WORKING BY LASER BEAM</topic><toplevel>online_resources</toplevel><creatorcontrib>YAMADA YO</creatorcontrib><creatorcontrib>YAMAGAME TOMOHIRO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>YAMADA YO</au><au>YAMAGAME TOMOHIRO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>수용성 플럭스 및 솔더 페이스트</title><date>2024-07-05</date><risdate>2024</risdate><abstract>보이드의 발생을 보다 억제할 수 있는 수용성 플럭스는, 융점이 40℃ 이하인 케토산과, 비점이 240℃ 이하인 용제를 함유한다.
This water-soluble flux capable of further suppressing the occurrence of voids contains a keto acid having a melting point of 40° C. or lower and a solvent having a boiling point of 240° C. or lower.</abstract><oa>free_for_read</oa></addata></record> |
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subjects | CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM |
title | 수용성 플럭스 및 솔더 페이스트 |
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