수용성 플럭스 및 솔더 페이스트

보이드의 발생을 보다 억제할 수 있는 수용성 플럭스는, 융점이 40℃ 이하인 케토산과, 비점이 240℃ 이하인 용제를 함유한다. This water-soluble flux capable of further suppressing the occurrence of voids contains a keto acid having a melting point of 40° C. or lower and a solvent having a boiling point of 240° C. or lower....

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Bibliographische Detailangaben
Hauptverfasser:	YAMADA YO, YAMAGAME TOMOHIRO
Format:	Patent
Sprache:	kor
Schlagworte:	CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	보이드의 발생을 보다 억제할 수 있는 수용성 플럭스는, 융점이 40℃ 이하인 케토산과, 비점이 240℃ 이하인 용제를 함유한다. This water-soluble flux capable of further suppressing the occurrence of voids contains a keto acid having a melting point of 40° C. or lower and a solvent having a boiling point of 240° C. or lower.