기판 처리 장치 및 기판 처리 방법
기판 처리 장치는, 박화될 예정인 제 1 기판에 접합되는 접합면과 상기 접합면과는 반대 방향의 비접합면을 가지는 제 2 기판의 상기 비접합면에 막을 형성하는 막 형성부와, 상기 막 형성부를 제어하는 제어부를 구비한다. 상기 제어부는, 상기 제 2 기판의 두께 분포에 기초하여, 상기 비접합면의 일부에 상기 막을 형성하거나, 또는 상기 비접합면의 일부에 다른 일부보다 두껍게 상기 막을 형성하는 제어를 행한다. A substrate processing apparatus includes a film forming device configu...
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| creator | SAKAUE TAKASHI HAYAKAWA SUSUMU |
| description | 기판 처리 장치는, 박화될 예정인 제 1 기판에 접합되는 접합면과 상기 접합면과는 반대 방향의 비접합면을 가지는 제 2 기판의 상기 비접합면에 막을 형성하는 막 형성부와, 상기 막 형성부를 제어하는 제어부를 구비한다. 상기 제어부는, 상기 제 2 기판의 두께 분포에 기초하여, 상기 비접합면의 일부에 상기 막을 형성하거나, 또는 상기 비접합면의 일부에 다른 일부보다 두껍게 상기 막을 형성하는 제어를 행한다.
A substrate processing apparatus includes a film forming device configured to form a film on a non-bonding surface of a second substrate, which has a bonding surface bonded to a first substrate to be thinned and the non-bonding surface opposite to the bonding surface; and a controller configured to control the film forming device. The controller performs a control of forming the film on a portion of the non-bonding surface or forming the film thicker on a portion of the non-bonding surface than on another portion thereof, based on a thickness distribution of the second substrate. |
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A substrate processing apparatus includes a film forming device configured to form a film on a non-bonding surface of a second substrate, which has a bonding surface bonded to a first substrate to be thinned and the non-bonding surface opposite to the bonding surface; and a controller configured to control the film forming device. The controller performs a control of forming the film on a portion of the non-bonding surface or forming the film thicker on a portion of the non-bonding surface than on another portion thereof, based on a thickness distribution of the second substrate.</description><language>kor</language><subject>APPARATUS SPECIALLY ADAPTED THEREFOR ; BASIC ELECTRIC ELEMENTS ; CINEMATOGRAPHY ; DRESSING OR CONDITIONING OF ABRADING SURFACES ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; ELECTROGRAPHY ; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS ; GRINDING ; HOLOGRAPHY ; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING ; MATERIALS THEREFOR ; ORIGINALS THEREFOR ; PERFORMING OPERATIONS ; PHOTOGRAPHY ; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES ; PHYSICS ; POLISHING ; SEMICONDUCTOR DEVICES ; TRANSPORTING</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240621&DB=EPODOC&CC=KR&NR=20240090585A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240621&DB=EPODOC&CC=KR&NR=20240090585A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>SAKAUE TAKASHI</creatorcontrib><creatorcontrib>HAYAKAWA SUSUMU</creatorcontrib><title>기판 처리 장치 및 기판 처리 방법</title><description>기판 처리 장치는, 박화될 예정인 제 1 기판에 접합되는 접합면과 상기 접합면과는 반대 방향의 비접합면을 가지는 제 2 기판의 상기 비접합면에 막을 형성하는 막 형성부와, 상기 막 형성부를 제어하는 제어부를 구비한다. 상기 제어부는, 상기 제 2 기판의 두께 분포에 기초하여, 상기 비접합면의 일부에 상기 막을 형성하거나, 또는 상기 비접합면의 일부에 다른 일부보다 두껍게 상기 막을 형성하는 제어를 행한다.
A substrate processing apparatus includes a film forming device configured to form a film on a non-bonding surface of a second substrate, which has a bonding surface bonded to a first substrate to be thinned and the non-bonding surface opposite to the bonding surface; and a controller configured to control the film forming device. The controller performs a control of forming the film on a portion of the non-bonding surface or forming the film thicker on a portion of the non-bonding surface than on another portion thereof, based on a thickness distribution of the second substrate.</description><subject>APPARATUS SPECIALLY ADAPTED THEREFOR</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CINEMATOGRAPHY</subject><subject>DRESSING OR CONDITIONING OF ABRADING SURFACES</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>ELECTROGRAPHY</subject><subject>FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS</subject><subject>GRINDING</subject><subject>HOLOGRAPHY</subject><subject>MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING</subject><subject>MATERIALS THEREFOR</subject><subject>ORIGINALS THEREFOR</subject><subject>PERFORMING OPERATIONS</subject><subject>PHOTOGRAPHY</subject><subject>PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES</subject><subject>PHYSICS</subject><subject>POLISHING</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZNB9tWPD254JCm82zXi9bI3Cm3lL3-ycofB6Q78CqsTrDStfb5rKw8CalphTnMoLpbkZlN1cQ5w9dFML8uNTiwsSk1PzUkvivYOMDIxMDAwsDUwtTB2NiVMFAPw5N14</recordid><startdate>20240621</startdate><enddate>20240621</enddate><creator>SAKAUE TAKASHI</creator><creator>HAYAKAWA SUSUMU</creator><scope>EVB</scope></search><sort><creationdate>20240621</creationdate><title>기판 처리 장치 및 기판 처리 방법</title><author>SAKAUE TAKASHI ; HAYAKAWA SUSUMU</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_KR20240090585A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>kor</language><creationdate>2024</creationdate><topic>APPARATUS SPECIALLY ADAPTED THEREFOR</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CINEMATOGRAPHY</topic><topic>DRESSING OR CONDITIONING OF ABRADING SURFACES</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>ELECTROGRAPHY</topic><topic>FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS</topic><topic>GRINDING</topic><topic>HOLOGRAPHY</topic><topic>MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING</topic><topic>MATERIALS THEREFOR</topic><topic>ORIGINALS THEREFOR</topic><topic>PERFORMING OPERATIONS</topic><topic>PHOTOGRAPHY</topic><topic>PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES</topic><topic>PHYSICS</topic><topic>POLISHING</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>SAKAUE TAKASHI</creatorcontrib><creatorcontrib>HAYAKAWA SUSUMU</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>SAKAUE TAKASHI</au><au>HAYAKAWA SUSUMU</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>기판 처리 장치 및 기판 처리 방법</title><date>2024-06-21</date><risdate>2024</risdate><abstract>기판 처리 장치는, 박화될 예정인 제 1 기판에 접합되는 접합면과 상기 접합면과는 반대 방향의 비접합면을 가지는 제 2 기판의 상기 비접합면에 막을 형성하는 막 형성부와, 상기 막 형성부를 제어하는 제어부를 구비한다. 상기 제어부는, 상기 제 2 기판의 두께 분포에 기초하여, 상기 비접합면의 일부에 상기 막을 형성하거나, 또는 상기 비접합면의 일부에 다른 일부보다 두껍게 상기 막을 형성하는 제어를 행한다.
A substrate processing apparatus includes a film forming device configured to form a film on a non-bonding surface of a second substrate, which has a bonding surface bonded to a first substrate to be thinned and the non-bonding surface opposite to the bonding surface; and a controller configured to control the film forming device. The controller performs a control of forming the film on a portion of the non-bonding surface or forming the film thicker on a portion of the non-bonding surface than on another portion thereof, based on a thickness distribution of the second substrate.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | APPARATUS SPECIALLY ADAPTED THEREFOR BASIC ELECTRIC ELEMENTS CINEMATOGRAPHY DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING HOLOGRAPHY MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING MATERIALS THEREFOR ORIGINALS THEREFOR PERFORMING OPERATIONS PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS POLISHING SEMICONDUCTOR DEVICES TRANSPORTING |
| title | 기판 처리 장치 및 기판 처리 방법 |
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