경량 충전제를 갖는 접착제 조성물
접착성 화합물; 및 열경화성 물질을 포함하는 코팅이 외부 표면 상에 침착되어 있는 외부 표면을 각각 포함하는 복수의 입자를 포함하는 접착제 조성물, 및 접착제 조성물을 제1 기재에 도포하는 단계; 및 접착제 조성물이 제1 기재와 제2 기재 사이에 위치하도록 제2 기재를 접착제 조성물에 접촉시키는 단계를 포함하는 어셈블리 형성 방법. 또한, 제1 기재 및 제2 기재 및 그 사이의 접착제 조성물을 포함하는 어셈블리, 및 접착제 조성물 제조방법. An adhesive composition including an adhesive compo...
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| creator | POLLUM JR. MARVIN MICHAEL SINGERLING JACOB ANDREW CONDIE ALLISON GAMBLE NAKAJIMA MASAYUKI |
| description | 접착성 화합물; 및 열경화성 물질을 포함하는 코팅이 외부 표면 상에 침착되어 있는 외부 표면을 각각 포함하는 복수의 입자를 포함하는 접착제 조성물, 및 접착제 조성물을 제1 기재에 도포하는 단계; 및 접착제 조성물이 제1 기재와 제2 기재 사이에 위치하도록 제2 기재를 접착제 조성물에 접촉시키는 단계를 포함하는 어셈블리 형성 방법. 또한, 제1 기재 및 제2 기재 및 그 사이의 접착제 조성물을 포함하는 어셈블리, 및 접착제 조성물 제조방법.
An adhesive composition including an adhesive compound; and a plurality of particles each comprising an exterior surface comprising a coating deposited thereon wherein the coating comprises a thermoset material and a method or forming an assembly including applying an adhesive composition to a first substrate; and contacting a second substrate to the adhesive composition such that the adhesive composition is located between the first substrate and the second substrate. Also, an assembly including a first substrate and a second substrate and an adhesive composition therebetween and a method of preparing an adhesive composition. |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_KR20240055820A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>KR20240055820A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_KR20240055820A3</originalsourceid><addsrcrecordid>eNrjZNB7tWnv6_mdCm-2rXyzoOXNgjmvl-5ReLVh2uuuKQpvFkx8swEoPEfhzcINb1o2vl6zh4eBNS0xpziVF0pzMyi7uYY4e-imFuTHpxYXJCan5qWWxHsHGRkYmRgYmJpaGBk4GhOnCgDWaTkY</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>경량 충전제를 갖는 접착제 조성물</title><source>esp@cenet</source><creator>POLLUM JR. MARVIN MICHAEL ; SINGERLING JACOB ANDREW ; CONDIE ALLISON GAMBLE ; NAKAJIMA MASAYUKI</creator><creatorcontrib>POLLUM JR. MARVIN MICHAEL ; SINGERLING JACOB ANDREW ; CONDIE ALLISON GAMBLE ; NAKAJIMA MASAYUKI</creatorcontrib><description>접착성 화합물; 및 열경화성 물질을 포함하는 코팅이 외부 표면 상에 침착되어 있는 외부 표면을 각각 포함하는 복수의 입자를 포함하는 접착제 조성물, 및 접착제 조성물을 제1 기재에 도포하는 단계; 및 접착제 조성물이 제1 기재와 제2 기재 사이에 위치하도록 제2 기재를 접착제 조성물에 접촉시키는 단계를 포함하는 어셈블리 형성 방법. 또한, 제1 기재 및 제2 기재 및 그 사이의 접착제 조성물을 포함하는 어셈블리, 및 접착제 조성물 제조방법.
An adhesive composition including an adhesive compound; and a plurality of particles each comprising an exterior surface comprising a coating deposited thereon wherein the coating comprises a thermoset material and a method or forming an assembly including applying an adhesive composition to a first substrate; and contacting a second substrate to the adhesive composition such that the adhesive composition is located between the first substrate and the second substrate. Also, an assembly including a first substrate and a second substrate and an adhesive composition therebetween and a method of preparing an adhesive composition.</description><language>kor</language><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ; ADHESIVES ; CHEMISTRY ; COMPOSITIONS BASED THEREON ; DYES ; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS ; METALLURGY ; MISCELLANEOUS APPLICATIONS OF MATERIALS ; MISCELLANEOUS COMPOSITIONS ; NATURAL RESINS ; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ; ORGANIC MACROMOLECULAR COMPOUNDS ; PAINTS ; POLISHES ; THEIR PREPARATION OR CHEMICAL WORKING-UP ; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS ; USE OF MATERIALS AS ADHESIVES</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240429&DB=EPODOC&CC=KR&NR=20240055820A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240429&DB=EPODOC&CC=KR&NR=20240055820A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>POLLUM JR. MARVIN MICHAEL</creatorcontrib><creatorcontrib>SINGERLING JACOB ANDREW</creatorcontrib><creatorcontrib>CONDIE ALLISON GAMBLE</creatorcontrib><creatorcontrib>NAKAJIMA MASAYUKI</creatorcontrib><title>경량 충전제를 갖는 접착제 조성물</title><description>접착성 화합물; 및 열경화성 물질을 포함하는 코팅이 외부 표면 상에 침착되어 있는 외부 표면을 각각 포함하는 복수의 입자를 포함하는 접착제 조성물, 및 접착제 조성물을 제1 기재에 도포하는 단계; 및 접착제 조성물이 제1 기재와 제2 기재 사이에 위치하도록 제2 기재를 접착제 조성물에 접촉시키는 단계를 포함하는 어셈블리 형성 방법. 또한, 제1 기재 및 제2 기재 및 그 사이의 접착제 조성물을 포함하는 어셈블리, 및 접착제 조성물 제조방법.
An adhesive composition including an adhesive compound; and a plurality of particles each comprising an exterior surface comprising a coating deposited thereon wherein the coating comprises a thermoset material and a method or forming an assembly including applying an adhesive composition to a first substrate; and contacting a second substrate to the adhesive composition such that the adhesive composition is located between the first substrate and the second substrate. Also, an assembly including a first substrate and a second substrate and an adhesive composition therebetween and a method of preparing an adhesive composition.</description><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE</subject><subject>ADHESIVES</subject><subject>CHEMISTRY</subject><subject>COMPOSITIONS BASED THEREON</subject><subject>DYES</subject><subject>MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS</subject><subject>METALLURGY</subject><subject>MISCELLANEOUS APPLICATIONS OF MATERIALS</subject><subject>MISCELLANEOUS COMPOSITIONS</subject><subject>NATURAL RESINS</subject><subject>NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL</subject><subject>ORGANIC MACROMOLECULAR COMPOUNDS</subject><subject>PAINTS</subject><subject>POLISHES</subject><subject>THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><subject>USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS</subject><subject>USE OF MATERIALS AS ADHESIVES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZNB7tWnv6_mdCm-2rXyzoOXNgjmvl-5ReLVh2uuuKQpvFkx8swEoPEfhzcINb1o2vl6zh4eBNS0xpziVF0pzMyi7uYY4e-imFuTHpxYXJCan5qWWxHsHGRkYmRgYmJpaGBk4GhOnCgDWaTkY</recordid><startdate>20240429</startdate><enddate>20240429</enddate><creator>POLLUM JR. MARVIN MICHAEL</creator><creator>SINGERLING JACOB ANDREW</creator><creator>CONDIE ALLISON GAMBLE</creator><creator>NAKAJIMA MASAYUKI</creator><scope>EVB</scope></search><sort><creationdate>20240429</creationdate><title>경량 충전제를 갖는 접착제 조성물</title><author>POLLUM JR. MARVIN MICHAEL ; SINGERLING JACOB ANDREW ; CONDIE ALLISON GAMBLE ; NAKAJIMA MASAYUKI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_KR20240055820A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>kor</language><creationdate>2024</creationdate><topic>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE</topic><topic>ADHESIVES</topic><topic>CHEMISTRY</topic><topic>COMPOSITIONS BASED THEREON</topic><topic>DYES</topic><topic>MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS</topic><topic>METALLURGY</topic><topic>MISCELLANEOUS APPLICATIONS OF MATERIALS</topic><topic>MISCELLANEOUS COMPOSITIONS</topic><topic>NATURAL RESINS</topic><topic>NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL</topic><topic>ORGANIC MACROMOLECULAR COMPOUNDS</topic><topic>PAINTS</topic><topic>POLISHES</topic><topic>THEIR PREPARATION OR CHEMICAL WORKING-UP</topic><topic>USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS</topic><topic>USE OF MATERIALS AS ADHESIVES</topic><toplevel>online_resources</toplevel><creatorcontrib>POLLUM JR. MARVIN MICHAEL</creatorcontrib><creatorcontrib>SINGERLING JACOB ANDREW</creatorcontrib><creatorcontrib>CONDIE ALLISON GAMBLE</creatorcontrib><creatorcontrib>NAKAJIMA MASAYUKI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>POLLUM JR. MARVIN MICHAEL</au><au>SINGERLING JACOB ANDREW</au><au>CONDIE ALLISON GAMBLE</au><au>NAKAJIMA MASAYUKI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>경량 충전제를 갖는 접착제 조성물</title><date>2024-04-29</date><risdate>2024</risdate><abstract>접착성 화합물; 및 열경화성 물질을 포함하는 코팅이 외부 표면 상에 침착되어 있는 외부 표면을 각각 포함하는 복수의 입자를 포함하는 접착제 조성물, 및 접착제 조성물을 제1 기재에 도포하는 단계; 및 접착제 조성물이 제1 기재와 제2 기재 사이에 위치하도록 제2 기재를 접착제 조성물에 접촉시키는 단계를 포함하는 어셈블리 형성 방법. 또한, 제1 기재 및 제2 기재 및 그 사이의 접착제 조성물을 포함하는 어셈블리, 및 접착제 조성물 제조방법.
An adhesive composition including an adhesive compound; and a plurality of particles each comprising an exterior surface comprising a coating deposited thereon wherein the coating comprises a thermoset material and a method or forming an assembly including applying an adhesive composition to a first substrate; and contacting a second substrate to the adhesive composition such that the adhesive composition is located between the first substrate and the second substrate. Also, an assembly including a first substrate and a second substrate and an adhesive composition therebetween and a method of preparing an adhesive composition.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY COMPOSITIONS BASED THEREON DYES MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS USE OF MATERIALS AS ADHESIVES |
| title | 경량 충전제를 갖는 접착제 조성물 |
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