커버 테이프 및 전자 부품 포장체

기재층(3)과, 상기 기재층(3)의 일방의 면에 적층된 실런트층(2)을 포함하는 전자 부품 포장용의 커버 테이프(10)로서, 상기 실런트층(2)은, (A) (메트)아크릴레이트 공중합체와, (B) 석유 수지를 포함하는 커버 테이프(10). A cover tape (10) for electronic component packaging comprises a base layer (3) and a sealant layer (2) that is layered on one side of the base layer (3), wherein the...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	ABE HIROKI, MASUI KEN
Format:	Patent
Sprache:	kor
Schlagworte:	ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR BASIC ELECTRIC ELEMENTS CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS,e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES,DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS CONVEYING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY HANDLING THIN OR FILAMENTARY MATERIAL LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM PACKAGES PACKAGING ELEMENTS PACKING PERFORMING OPERATIONS SEMICONDUCTOR DEVICES STORING TRANSPORTING
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	기재층(3)과, 상기 기재층(3)의 일방의 면에 적층된 실런트층(2)을 포함하는 전자 부품 포장용의 커버 테이프(10)로서, 상기 실런트층(2)은, (A) (메트)아크릴레이트 공중합체와, (B) 석유 수지를 포함하는 커버 테이프(10). A cover tape (10) for electronic component packaging comprises a base layer (3) and a sealant layer (2) that is layered on one side of the base layer (3), wherein the sealant layer (2) includes (A) a (meth)acrylate copolymer and (B) a petroleum resin.