수지 조성물, 프리프레그, 적층판, 수지 필름, 프린트 배선판 및 반도체 패키지

(A) 열경화성 수지와, (B) 폴리페닐렌에테르계 수지와, (C) 제1급 아미노기를 갖는 알콕시실란 화합물과, (D) 무기 충전재를 함유하는 수지 조성물, 해당 수지 조성물을 사용한 프리프레그, 적층판, 수지 필름, 프린트 배선판 및 반도체 패키지에 관한 것이다. The present invention relates to: a resin composition comprising (A) a heat-curable resin, (B) a poly(phenylene ether)-based resin, (C) an alkoxysilane...

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Bibliographische Detailangaben
Hauptverfasser:	NAKAMURA YUKIO, FUJII TOSHIKI, YANAGIDA MAKOTO, SHIMOKAWA RYO, HIDAKA YOSHIKI
Format:	Patent
Sprache:	kor
Schlagworte:	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL PROCESSES OF COMPOUNDING LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS PRINTED CIRCUITS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS WORKING-UP
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Beschreibung
Zusammenfassung:	(A) 열경화성 수지와, (B) 폴리페닐렌에테르계 수지와, (C) 제1급 아미노기를 갖는 알콕시실란 화합물과, (D) 무기 충전재를 함유하는 수지 조성물, 해당 수지 조성물을 사용한 프리프레그, 적층판, 수지 필름, 프린트 배선판 및 반도체 패키지에 관한 것이다. The present invention relates to: a resin composition comprising (A) a heat-curable resin, (B) a poly(phenylene ether)-based resin, (C) an alkoxysilane compound having a primary amino group, and (D) an inorganic filler; and a prepreg, a laminate, a resin film, a printed wiring board, and a semiconductor package each obtained using the resin composition.