플럭스 및 솔더 페이스트

벤조트리아졸 골격을 가지는 화합물(AZ1)과, 유기산(AC1)과, 용제(S1)를 함유하는, 플럭스를 채용한다. AC1은, 140℃에서 15분간 유지했을 때의 중량 감소율이 20 질량% 이하이다. S1은, 140℃에서 15분간 유지했을 때의 중량 감소율이 50 질량% 이하이다. A flux containing an organic acid (AC1), a solvent (S1), and a compound (AZ1) that has a benzotriazole skeleton is employed. AC1 has a rate of de...

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Bibliographische Detailangaben
Hauptverfasser:	KAWANAGO TOMOHISA, IKEDA ATSUSHI, KAJIKAWA YASUHIRO
Format:	Patent
Sprache:	kor
Schlagworte:	ALLOYS CHEMISTRY CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING FERROUS OR NON-FERROUS ALLOYS MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR METALLURGY PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING TREATMENT OF ALLOYS OR NON-FERROUS METALS WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	벤조트리아졸 골격을 가지는 화합물(AZ1)과, 유기산(AC1)과, 용제(S1)를 함유하는, 플럭스를 채용한다. AC1은, 140℃에서 15분간 유지했을 때의 중량 감소율이 20 질량% 이하이다. S1은, 140℃에서 15분간 유지했을 때의 중량 감소율이 50 질량% 이하이다. A flux containing an organic acid (AC1), a solvent (S1), and a compound (AZ1) that has a benzotriazole skeleton is employed. AC1 has a rate of decrease in weight of 20% by mass or less in a case of being held at 140° C. for 15 minutes. S1 has a rate of decrease in weight of 50% by mass or less in a case of being held at 140° C. for 15 minutes.