Method for fabricating a semiconductor package
반도체 패키지가 제공된다. 반도체 패키지는 하면에 솔더볼이 형성된 반도체 칩을 제공하고, 반도체 칩의 상면 상에 접착층을 형성하고, 솔더볼을 이용하여 제1 웨이퍼 상에 반도체 칩을 실장시키고, 제1 웨이퍼 및 반도체 칩 상에서, 접착층에 제2 웨이퍼를 본딩시키고, 제1 웨이퍼와 제2 웨이퍼 사이에 몰딩층을 형성하고, 및 제1 웨이퍼, 몰딩층 및 제2 웨이퍼를 절단하는 것을 포함한다. A method of fabricating a semiconductor package includes providing a semiconductor c...
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| creator | LEE JEONG HYUN PARK JI YONG YIM CHOONG BIN |
| description | 반도체 패키지가 제공된다. 반도체 패키지는 하면에 솔더볼이 형성된 반도체 칩을 제공하고, 반도체 칩의 상면 상에 접착층을 형성하고, 솔더볼을 이용하여 제1 웨이퍼 상에 반도체 칩을 실장시키고, 제1 웨이퍼 및 반도체 칩 상에서, 접착층에 제2 웨이퍼를 본딩시키고, 제1 웨이퍼와 제2 웨이퍼 사이에 몰딩층을 형성하고, 및 제1 웨이퍼, 몰딩층 및 제2 웨이퍼를 절단하는 것을 포함한다.
A method of fabricating a semiconductor package includes providing a semiconductor chip having solder balls formed on a bottom surface thereof, forming an adhesive layer on a top surface of the semiconductor chip, mounting the semiconductor chip on a first wafer using the solder balls, bonding a second wafer to the first wafer and to the adhesive layer of the semiconductor chip that is mounted on the first wafer, forming a molding layer between the first wafer and the second wafer, and cutting the first wafer, the molding layer and the second wafer. |
| format | Patent |
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A method of fabricating a semiconductor package includes providing a semiconductor chip having solder balls formed on a bottom surface thereof, forming an adhesive layer on a top surface of the semiconductor chip, mounting the semiconductor chip on a first wafer using the solder balls, bonding a second wafer to the first wafer and to the adhesive layer of the semiconductor chip that is mounted on the first wafer, forming a molding layer between the first wafer and the second wafer, and cutting the first wafer, the molding layer and the second wafer.</description><language>eng ; kor</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240129&DB=EPODOC&CC=KR&NR=20240012041A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240129&DB=EPODOC&CC=KR&NR=20240012041A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>LEE JEONG HYUN</creatorcontrib><creatorcontrib>PARK JI YONG</creatorcontrib><creatorcontrib>YIM CHOONG BIN</creatorcontrib><title>Method for fabricating a semiconductor package</title><description>반도체 패키지가 제공된다. 반도체 패키지는 하면에 솔더볼이 형성된 반도체 칩을 제공하고, 반도체 칩의 상면 상에 접착층을 형성하고, 솔더볼을 이용하여 제1 웨이퍼 상에 반도체 칩을 실장시키고, 제1 웨이퍼 및 반도체 칩 상에서, 접착층에 제2 웨이퍼를 본딩시키고, 제1 웨이퍼와 제2 웨이퍼 사이에 몰딩층을 형성하고, 및 제1 웨이퍼, 몰딩층 및 제2 웨이퍼를 절단하는 것을 포함한다.
A method of fabricating a semiconductor package includes providing a semiconductor chip having solder balls formed on a bottom surface thereof, forming an adhesive layer on a top surface of the semiconductor chip, mounting the semiconductor chip on a first wafer using the solder balls, bonding a second wafer to the first wafer and to the adhesive layer of the semiconductor chip that is mounted on the first wafer, forming a molding layer between the first wafer and the second wafer, and cutting the first wafer, the molding layer and the second wafer.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZNDzTS3JyE9RSMsvUkhLTCrKTE4sycxLV0hUKE7NzUzOz0spTS4ByhUkJmcnpqfyMLCmJeYUp_JCaW4GZTfXEGcP3dSC_PjUYqCq1LzUknjvICMDIxMDA0MjAxNDR2PiVAEAmAcrPw</recordid><startdate>20240129</startdate><enddate>20240129</enddate><creator>LEE JEONG HYUN</creator><creator>PARK JI YONG</creator><creator>YIM CHOONG BIN</creator><scope>EVB</scope></search><sort><creationdate>20240129</creationdate><title>Method for fabricating a semiconductor package</title><author>LEE JEONG HYUN ; PARK JI YONG ; YIM CHOONG BIN</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_KR20240012041A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; kor</language><creationdate>2024</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>LEE JEONG HYUN</creatorcontrib><creatorcontrib>PARK JI YONG</creatorcontrib><creatorcontrib>YIM CHOONG BIN</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>LEE JEONG HYUN</au><au>PARK JI YONG</au><au>YIM CHOONG BIN</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Method for fabricating a semiconductor package</title><date>2024-01-29</date><risdate>2024</risdate><abstract>반도체 패키지가 제공된다. 반도체 패키지는 하면에 솔더볼이 형성된 반도체 칩을 제공하고, 반도체 칩의 상면 상에 접착층을 형성하고, 솔더볼을 이용하여 제1 웨이퍼 상에 반도체 칩을 실장시키고, 제1 웨이퍼 및 반도체 칩 상에서, 접착층에 제2 웨이퍼를 본딩시키고, 제1 웨이퍼와 제2 웨이퍼 사이에 몰딩층을 형성하고, 및 제1 웨이퍼, 몰딩층 및 제2 웨이퍼를 절단하는 것을 포함한다.
A method of fabricating a semiconductor package includes providing a semiconductor chip having solder balls formed on a bottom surface thereof, forming an adhesive layer on a top surface of the semiconductor chip, mounting the semiconductor chip on a first wafer using the solder balls, bonding a second wafer to the first wafer and to the adhesive layer of the semiconductor chip that is mounted on the first wafer, forming a molding layer between the first wafer and the second wafer, and cutting the first wafer, the molding layer and the second wafer.</abstract><oa>free_for_read</oa></addata></record> |
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| title | Method for fabricating a semiconductor package |
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