ADHESIVE COMPOSITION AND STRUCTURAL BODY

음이온 중합 또는 양이온 중합 가능한 에폭시 수지 또는 옥세탄 수지와, 상기 에폭시 수지 또는 옥세탄 수지와 반응하는 관능기를 갖는 제1 실란 화합물과, 상기 제1 실란 화합물과 반응하는 제2 실란 화합물을 함유하는, 접착제 조성물. The present invention provides an adhesive composition containing: an anionic polymerizable or cationic polymerizable epoxy resin or oxetane resin; a first silane compou...

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Bibliographische Detailangaben
Hauptverfasser:	MORIJIRI TOMOKI, MORI SATORU, MATSUDA KAZUYA, KUDOU SUNAO, IZAWA HIROYUKI, TANAKA MASARU
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	음이온 중합 또는 양이온 중합 가능한 에폭시 수지 또는 옥세탄 수지와, 상기 에폭시 수지 또는 옥세탄 수지와 반응하는 관능기를 갖는 제1 실란 화합물과, 상기 제1 실란 화합물과 반응하는 제2 실란 화합물을 함유하는, 접착제 조성물. The present invention provides an adhesive composition containing: an anionic polymerizable or cationic polymerizable epoxy resin or oxetane resin; a first silane compound having a functional group that reacts with the epoxy resin or oxetane resin; and a second silane compound that reacts with the first silane compound.