볼록 다각형 형상 연마 부재를 갖는 양면 연삭 장치
반도체 구조들을 동시 양면 연삭하기 위한 방법들 및 장치가 개시된다. 양면 연삭 장치는 볼록 다각형(예를 들어, 볼록 오각형)으로서 성형된 연마 부재를 각각 갖는 제1 및 제2 연삭 휠을 포함할 수 있다. Methods and apparatus for simultaneous double-side grinding semiconductor structures are disclosed. The double-side grinding apparatus may include first and second grinding wheels each...
Gespeichert in:
| Hauptverfasser: | , , , , , |
|---|---|
| Format: | Patent |
| Sprache: | kor |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | CHOI CHEULWON LEE MINKYU LEE JAEHOON LEE BYUNGCHUL KIM JONGSUN KWEON HYOSHIK |
| description | 반도체 구조들을 동시 양면 연삭하기 위한 방법들 및 장치가 개시된다. 양면 연삭 장치는 볼록 다각형(예를 들어, 볼록 오각형)으로서 성형된 연마 부재를 각각 갖는 제1 및 제2 연삭 휠을 포함할 수 있다.
Methods and apparatus for simultaneous double-side grinding semiconductor structures are disclosed. The double-side grinding apparatus may include first and second grinding wheels each having abrasive members that are shaped as a convex polygon (e.g., convex pentagon). |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_KR20230175281A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>KR20230175281A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_KR20230175281A3</originalsourceid><addsrcrecordid>eNrjZHB5vXnP64VzFV53L3m1ofHtjKkKQPymuVHhzfQNr5d3KLze1vBm3prXS_covNow7XXXFIU30ya-XrkFJP2maa3Cm3lL3-ycwcPAmpaYU5zKC6W5GZTdXEOcPXRTC_LjU4sLEpNT81JL4r2DjAyMjA0MzU2NLAwdjYlTBQCojEYf</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>볼록 다각형 형상 연마 부재를 갖는 양면 연삭 장치</title><source>esp@cenet</source><creator>CHOI CHEULWON ; LEE MINKYU ; LEE JAEHOON ; LEE BYUNGCHUL ; KIM JONGSUN ; KWEON HYOSHIK</creator><creatorcontrib>CHOI CHEULWON ; LEE MINKYU ; LEE JAEHOON ; LEE BYUNGCHUL ; KIM JONGSUN ; KWEON HYOSHIK</creatorcontrib><description>반도체 구조들을 동시 양면 연삭하기 위한 방법들 및 장치가 개시된다. 양면 연삭 장치는 볼록 다각형(예를 들어, 볼록 오각형)으로서 성형된 연마 부재를 각각 갖는 제1 및 제2 연삭 휠을 포함할 수 있다.
Methods and apparatus for simultaneous double-side grinding semiconductor structures are disclosed. The double-side grinding apparatus may include first and second grinding wheels each having abrasive members that are shaped as a convex polygon (e.g., convex pentagon).</description><language>kor</language><subject>DRESSING OR CONDITIONING OF ABRADING SURFACES ; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS ; GRINDING ; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING ; PERFORMING OPERATIONS ; POLISHING ; TRANSPORTING</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20231229&DB=EPODOC&CC=KR&NR=20230175281A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20231229&DB=EPODOC&CC=KR&NR=20230175281A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>CHOI CHEULWON</creatorcontrib><creatorcontrib>LEE MINKYU</creatorcontrib><creatorcontrib>LEE JAEHOON</creatorcontrib><creatorcontrib>LEE BYUNGCHUL</creatorcontrib><creatorcontrib>KIM JONGSUN</creatorcontrib><creatorcontrib>KWEON HYOSHIK</creatorcontrib><title>볼록 다각형 형상 연마 부재를 갖는 양면 연삭 장치</title><description>반도체 구조들을 동시 양면 연삭하기 위한 방법들 및 장치가 개시된다. 양면 연삭 장치는 볼록 다각형(예를 들어, 볼록 오각형)으로서 성형된 연마 부재를 각각 갖는 제1 및 제2 연삭 휠을 포함할 수 있다.
Methods and apparatus for simultaneous double-side grinding semiconductor structures are disclosed. The double-side grinding apparatus may include first and second grinding wheels each having abrasive members that are shaped as a convex polygon (e.g., convex pentagon).</description><subject>DRESSING OR CONDITIONING OF ABRADING SURFACES</subject><subject>FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS</subject><subject>GRINDING</subject><subject>MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING</subject><subject>PERFORMING OPERATIONS</subject><subject>POLISHING</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZHB5vXnP64VzFV53L3m1ofHtjKkKQPymuVHhzfQNr5d3KLze1vBm3prXS_covNow7XXXFIU30ya-XrkFJP2maa3Cm3lL3-ycwcPAmpaYU5zKC6W5GZTdXEOcPXRTC_LjU4sLEpNT81JL4r2DjAyMjA0MzU2NLAwdjYlTBQCojEYf</recordid><startdate>20231229</startdate><enddate>20231229</enddate><creator>CHOI CHEULWON</creator><creator>LEE MINKYU</creator><creator>LEE JAEHOON</creator><creator>LEE BYUNGCHUL</creator><creator>KIM JONGSUN</creator><creator>KWEON HYOSHIK</creator><scope>EVB</scope></search><sort><creationdate>20231229</creationdate><title>볼록 다각형 형상 연마 부재를 갖는 양면 연삭 장치</title><author>CHOI CHEULWON ; LEE MINKYU ; LEE JAEHOON ; LEE BYUNGCHUL ; KIM JONGSUN ; KWEON HYOSHIK</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_KR20230175281A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>kor</language><creationdate>2023</creationdate><topic>DRESSING OR CONDITIONING OF ABRADING SURFACES</topic><topic>FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS</topic><topic>GRINDING</topic><topic>MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING</topic><topic>PERFORMING OPERATIONS</topic><topic>POLISHING</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>CHOI CHEULWON</creatorcontrib><creatorcontrib>LEE MINKYU</creatorcontrib><creatorcontrib>LEE JAEHOON</creatorcontrib><creatorcontrib>LEE BYUNGCHUL</creatorcontrib><creatorcontrib>KIM JONGSUN</creatorcontrib><creatorcontrib>KWEON HYOSHIK</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>CHOI CHEULWON</au><au>LEE MINKYU</au><au>LEE JAEHOON</au><au>LEE BYUNGCHUL</au><au>KIM JONGSUN</au><au>KWEON HYOSHIK</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>볼록 다각형 형상 연마 부재를 갖는 양면 연삭 장치</title><date>2023-12-29</date><risdate>2023</risdate><abstract>반도체 구조들을 동시 양면 연삭하기 위한 방법들 및 장치가 개시된다. 양면 연삭 장치는 볼록 다각형(예를 들어, 볼록 오각형)으로서 성형된 연마 부재를 각각 갖는 제1 및 제2 연삭 휠을 포함할 수 있다.
Methods and apparatus for simultaneous double-side grinding semiconductor structures are disclosed. The double-side grinding apparatus may include first and second grinding wheels each having abrasive members that are shaped as a convex polygon (e.g., convex pentagon).</abstract><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | kor |
| recordid | cdi_epo_espacenet_KR20230175281A |
| source | esp@cenet |
| subjects | DRESSING OR CONDITIONING OF ABRADING SURFACES FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING TRANSPORTING |
| title | 볼록 다각형 형상 연마 부재를 갖는 양면 연삭 장치 |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-12T06%3A45%3A37IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=CHOI%20CHEULWON&rft.date=2023-12-29&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EKR20230175281A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |