A ULTRA-THIN POLYMER FOAM SHEET MANUFACTURING METHOD THEREOF AND AN ELECTRONIC COMPONENT HAVING THE SAME

The present invention provides an ultra-thin resin foam sheet comprising a composite resin in which 40 to 60 parts by weight of a polypropylene-based resin and 40 to 60 parts by weight of a rubber-based resin are mixed, wherein the average diameter of cells included in the resin foam sheet is 50 to...

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Bibliographische Detailangaben
Hauptverfasser:	JOO HYUN KI, LEE SEUNG HYUN, KIM TAE HYUNG, OH HEUNG SIK, PARK CHUL SUNG
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS GENERAL PROCESSES OF COMPOUNDING METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL WORKING-UP
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Beschreibung
Zusammenfassung:	The present invention provides an ultra-thin resin foam sheet comprising a composite resin in which 40 to 60 parts by weight of a polypropylene-based resin and 40 to 60 parts by weight of a rubber-based resin are mixed, wherein the average diameter of cells included in the resin foam sheet is 50 to 150 μm, the interlayer strength is 2.0 to 5 MPa, the 25% compression hardness is 2.0 to 5.5 kgf/cm^2, and the thickness is 0.05 to 1 mm. According to the present invention, the ultra-thin resin foam sheet having a very thin thickness has a small size of cells, and thus has good softness and excellent interlayer mechanical strength, thereby satisfying the performance required by a sealing material or an impact-resistant buffer material of an electronic device component such as an IT device. 본 발명은 폴리프로필렌계 수지 40 내지 60 중량부 및 러버계 수지 40 내지 60 중량부의 비율로 혼합된 복합수지를 포함하는 수지 발포체 시트이고, 상기 수지 발포체 시트에 포함된 셀의 평균 직경은 50 내지 150 μm이고, 층간 강도는 2.0 내지 5 MPa이고, 25% 압축경도는 2.0 내지 5.5 kgf/cm2이고,두께는 0.05 내지 1 mm인, 초박판 수지 발포체 시트를 제공한다. 본 발명에 따라 두께가 매우 얇은 초박판인 수지 발포체 시트는 작은 크기의 셀을 가짐으로서 소프트니스가 양호하면서도 층간 기계적 강도가 우수하므로, IT 기기와 같은 전자 기기 부품의 씰링재 또는 내충격 완충재가 요구하는 성능을 만족시킬 수 있다.