INSULATING LAYER FOR MULTILAYERED PRINTED CIRCUIT BOARD

The present invention provides an insulating layer for a multilayer printed circuit board which can easily form a fine pattern and has excellent metal adhesion. The insulating layer for a multilayer printed circuit board of the present invention comprises: an alkali-soluble resin including a resin i...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	JEONG WOO JAE, AHN JEONG HYUK, MUN JEONG WOOK
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PRINTED CIRCUITS THEIR PREPARATION OR CHEMICAL WORKING-UP
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Beschreibung
Zusammenfassung:	The present invention provides an insulating layer for a multilayer printed circuit board which can easily form a fine pattern and has excellent metal adhesion. The insulating layer for a multilayer printed circuit board of the present invention comprises: an alkali-soluble resin including a resin including a repeating unit represented by chemical formula 1 and chemical formula 2; and a polymer resin layer including the thermosetting binder. The insulating layer for a multilayer printed circuit board according to an exemplary embodiment of the present invention may have excellent mechanical properties such as tensile strength and Young's modulus, and may have excellent appearance even when exposed to extreme conditions. 본 발명은 다층인쇄회로기판용 절연층에 관한 것으로, 구체적으로 알칼리 가용성 수지를 제조하기 위하여 포함되는 화합물의 종류를 선택하여 금속 밀착력을 향상시킨 다층인쇄회로기판용 절연층에 관한 것이다.