Substrate process apparatus and substrate process method using the same

Provided is a substrate processing method comprising the steps of: arranging a substrate in a drying chamber; and supplying a fluid to the drying chamber in which the substrate is arranged, wherein the step of supplying the fluid to the drying chamber comprises the steps of: supplying a gas to the d...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: LEE KUNTACK, PARK JI HWAN, PARK SANGJINE
Format: Patent
Sprache:eng ; kor
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Beschreibung
Zusammenfassung:Provided is a substrate processing method comprising the steps of: arranging a substrate in a drying chamber; and supplying a fluid to the drying chamber in which the substrate is arranged, wherein the step of supplying the fluid to the drying chamber comprises the steps of: supplying a gas to the drying chamber; and supplying a supercritical fluid to the drying chamber after the supply of the gas is started. 건조 챔버에 기판을 배치하는 것; 및 상기 기판이 배치된 상기 건조 챔버에 유체를 공급하는 것; 을 포함하되, 상기 건조 챔버에 상기 유체를 공급하는 것은: 상기 건조 챔버에 가스를 공급하는 것; 및 상기 가스의 공급이 시작된 이후에, 상기 건조 챔버에 초임계 유체를 공급하는 것; 을 포함하는 기판 처리 방법이 제공된다.