THIOL-CONTAINING COMPOSITION

본 발명은 에폭시 화합물, 폴리티올 경화제 및 제2 경화제를 포함하는 조성물에 관한 것이다. 또한 조성물로 기재를 처리하는 방법 및 이러한 방법에 의해 형성된 기재가 개시되어 있다. The present invention is directed toward a composition comprising: an epoxy compound, a polythiol curing agent, and a second curing agent. Also disclosed are methods of treating a substrate with the...

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Bibliographische Detailangaben
Hauptverfasser:	ZHOU HONGYING, FRENCH MARIA S, NAKAJIMA MASAYUKI, CONDIE ALLISON G
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	ACOUSTICS ACOUSTICS NOT OTHERWISE PROVIDED FOR ADDITIVE MANUFACTURING TECHNOLOGY ADDITIVE MANUFACTURING, i.e. MANUFACTURING OFTHREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVEAGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING,STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMICAL PAINT OR INK REMOVERS CHEMISTRY COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS CORRECTING FLUIDS DYES FILLING PASTES INKS MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY METHODS OR DEVICES FOR PROTECTING AGAINST, OR FOR DAMPING,NOISE OR OTHER ACOUSTIC WAVES IN GENERAL MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS MUSICAL INSTRUMENTS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS PASTES OR SOLIDS FOR COLOURING OR PRINTING PERFORMING OPERATIONS PHYSICS POLISHES SOUND-PRODUCING DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING USE OF MATERIALS AS ADHESIVES USE OF MATERIALS THEREFOR WOODSTAINS
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Beschreibung
Zusammenfassung:	본 발명은 에폭시 화합물, 폴리티올 경화제 및 제2 경화제를 포함하는 조성물에 관한 것이다. 또한 조성물로 기재를 처리하는 방법 및 이러한 방법에 의해 형성된 기재가 개시되어 있다. The present invention is directed toward a composition comprising: an epoxy compound, a polythiol curing agent, and a second curing agent. Also disclosed are methods of treating a substrate with the composition and substrates formed by such methods.