Ceramic materials for transporting wafer and the manufacuring method of the same

The present invention relates to a conductive ceramic material for wafer transfer and a manufacturing method thereof. More specifically, the conductive ceramic material for wafer transfer is manufactured by adding Nb_2O_5 dopant to a TiO_2 base, wherein the content of Nb_2O_5 is added in the range of 0.5 to 1 mol when the combined mol of TiO_2 and Nb_2O_5 is 100 mol. According to the present invention, an import substitution effect can be expected by domestically producing a conductive wafer arm material through a new conductive ceramic composition for wafer transfer. 웨이퍼 이송용 도전성 세라믹 소재 및 그 제조방법에 관한 것으로서, 보다 상세하게는 TiO2 기지에 Nb2O5 도펀트를 첨가하여 제조하며, 상기 Nb2O5의 함량은 TiO2와 Nb2O5의 합산몰을 100몰로 하였을 때 0.5몰~1몰의 범위로 첨가되는 것을 특징으로 하는 웨이퍼 이송용 도전성 세라믹 소재를 제공한다.