Composition for processing the substrate and Method for processing the substrate using the same

A composition for processing a substrate of the present invention is a composition for processing a substrate coated with a metal-containing resist composition, wherein the composition contains organic solvents and additives, and the additives contain organofluorocarbon acid and organosulfonic acid....

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	JO SU YEON, HAH JUNG HWAN, YANG JIN SEOK
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY MATERIALS THEREFOR ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	A composition for processing a substrate of the present invention is a composition for processing a substrate coated with a metal-containing resist composition, wherein the composition contains organic solvents and additives, and the additives contain organofluorocarbon acid and organosulfonic acid. The influence on an underlying film on the substrate, such as an insulating film or a conductive film, can be reduced, and the stability (solubility) over time can also be improved. 본 발명의 기판 처리 조성물은, 금속 함유 레지스트 조성물이 도포된 기판을 처리하기 위한 조성물로서, 유기 용매와 첨가제를 포함하며, 첨가제는 유기플루오로화산 및 유기술폰산을 포함한다.