Device bonding apparatus using laser beam

The present invention relates to a device bonding apparatus, and more specifically, to a device bonding apparatus for bonding a device on a strip by using a laser beam. The device bonding apparatus (100) for bonding a plurality of devices (10) to a strip (20) comprises: one or more shuttle units (11...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	YOU, HONG JUN
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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