Head of component pickup device

According to one aspect of the present invention, provided is a head of a component pickup device comprising: a head frame part comprising a head housing; a pickup device installation part installed so as to move up/down with respect to the head housing, wherein a pickup device is installed; an air...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	KWON JONG HUN, HAN YOON SEOK
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CLEANING CLEANING IN GENERAL ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PERFORMING OPERATIONS PREVENTION OF FOULING IN GENERAL PRINTED CIRCUITS TRANSPORTING
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