ELECTRONIC DEVICE INCLUDING INTERPOSER

An interposer printed circuit board (PCB) according to an embodiment comprises: an insulating layer; a first via group; a first conductive pad; and a first solder layer. The insulating layer includes: a first surface and a second surface which is opposite to the first surface. The first via group co...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	DOHYEONG PARK, JUNGHOON PARK, MYUNGKYOON CHUNG
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC COMMUNICATION TECHNIQUE ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS TELEPHONIC COMMUNICATION
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