A module for heat dissipation and a method of manufacturing heat dissipation module

According to an embodiment of the present invention, a heat dissipating module comprises: a heat absorbing member absorbing heat generated by an electronic device while attached to the electronic device; at least one heat dissipating member receiving the heat absorbed by the heat absorbing member, a...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: SEO JIN KOOK, SUNWOO HEE MIN
Format: Patent
Sprache:eng ; kor
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!