CIRCUIT BOARD AND CHIP PACKAGE INCLUDING THE SAME

A circuit board according to an embodiment comprises: an insulating layer; and a circuit pattern layer disposed on the insulating layer, wherein the circuit pattern layer comprises a first metal layer disposed on the insulating layer and a second metal layer disposed on the first metal layer, and th...

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Bibliographische Detailangaben
Hauptverfasser:	ROH MYOUNG LAE, JO MIN SUNG, KIM KAB YOUNG
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	A circuit board according to an embodiment comprises: an insulating layer; and a circuit pattern layer disposed on the insulating layer, wherein the circuit pattern layer comprises a first metal layer disposed on the insulating layer and a second metal layer disposed on the first metal layer, and the insulating layer comprises an oxide layer formed by oxidizing a lower surface of the first metal layer. Therefore, the present invention is capable of providing the circuit board with a new structure. 실시 예에 따른 회로 기판은 절연층; 및 상기 절연층 상에 배치된 회로 패턴층을 포함하고, 상기 회로 패턴층은, 상기 절연층 상에 배치된 제1 금속층; 및 상기 제1 금속층 상에 배치된 제2 금속층을 포함하고, 상기 절연층은 상기 제1 금속층의 하면을 산화시켜 형성한 산화층을 포함한다.