CHEMICAL MECHANICAL POLISHING METHOD AND METHOD FOR FABRICATING SEMICONDUCTOR DEVICE USING THE SAME

Provided are a chemical mechanical polishing method, which is able to improve quality and productivity of a chemical mechanical polishing process, and a method for manufacturing a semiconductor device using the same. The chemical mechanical polishing method is for a target to be polished including a...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: BYUN YEA RIN, KIM IN KWON, KIM SANG KYUN, LEE HYO SAN
Format: Patent
Sprache:eng ; kor
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!