METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD WITH FINE PITCH

The present invention, in a subsequent copper plating etching step sheathing with a nickel plate on top of a base copper foil of a CCL core, has a technical feature in preventing the base copper foil from being etched. In this way, a modified semi-additive process (MSAP) can be performed based on th...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	YOON KWAN SUN, JANG YOUNG JIN, KWON DONG HYUN, LEE CHOONG SIK
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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