METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD WITH FINE PITCH

The present invention, in a subsequent copper plating etching step sheathing with a nickel plate on top of a base copper foil of a CCL core, has a technical feature in preventing the base copper foil from being etched. In this way, a modified semi-additive process (MSAP) can be performed based on th...

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Bibliographische Detailangaben
Hauptverfasser:	YOON KWAN SUN, JANG YOUNG JIN, KWON DONG HYUN, LEE CHOONG SIK
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	The present invention, in a subsequent copper plating etching step sheathing with a nickel plate on top of a base copper foil of a CCL core, has a technical feature in preventing the base copper foil from being etched. In this way, a modified semi-additive process (MSAP) can be performed based on the base copper foil remaining on an outer layer surface. 본 발명은 CCL 코어의 베이스 동박 위에 니켈 도금을 피복해서 후속 동도금 식각 단계에서 베이스 동박이 식각되지 아니하도록 하는 데 기술적 특징이 있다. 이와 같이 외층 표면에 남아 있는 베이스 동박을 바탕으로 MSAP(modified semi-additive process)을 진행할 수 있게 된다.