FORCE SENSOR IN AN ULTRASONIC WIRE BONDING DEVICE

A force sensor that determines a bonding force during wire bonding operations includes a piezoelectric sensing element mounted on an ultrasonic transducer of an ultrasonic wire bonding device, wherein the piezoelectric sensing element includes a first part and a second part, and first and second opp...

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Bibliographische Detailangaben
Hauptverfasser:	LAM HOI TING, YU TSZ KIT, LI HING LEUNG, PEH LY TAT
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MEASURING MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER,MECHANICAL EFFICIENCY, OR FLUID PRESSURE PHYSICS SEMICONDUCTOR DEVICES TESTING
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Beschreibung
Zusammenfassung:	A force sensor that determines a bonding force during wire bonding operations includes a piezoelectric sensing element mounted on an ultrasonic transducer of an ultrasonic wire bonding device, wherein the piezoelectric sensing element includes a first part and a second part, and first and second opposing surfaces. The first surface of the first part each has an anode and the second surface of the first part each has a cathode. The first surface of the second part has a cathode and the second surface of the second part has an anode, respectively. Thus, the present invention can provide an improved force sensor for effectively measuring bonding force in ultrasonic wire bonding devices during wire bonding operations in order to obtain more accurate measurement results. 와이어 본딩 작업들 동안 본딩력을 결정하는 힘 센서는 초음파 와이어 본딩 디바이스의 초음파 트랜스듀서에 장착되는 압전 센싱 소자를 포함하고, 압전 센싱 소자는 제1 부분과 제2 부분, 제1 및 제2 대향면들을 포함하고, 제1 부분의 제1 표면은 양극을 갖고 제1 부분의 제2 표면은 음극을 각각 갖고, 제2 부분의 제1 표면은 음극을 갖고 제2 부분의 제2 표면은 양극을 각각 갖는다.