IMPLEMENTING METHOD FOR STRUCTURAL COLOR AND ELECTRONIC DEVICE INCLUDING STRUCTURAL COLOR

According to various embodiments of the present disclosure, a method for implementing structural color comprises: an operation of forming an oxide layer on at least a portion of the surface of a metal substrate; an operation of coloring the oxide layer with a designated color and then sealing it; an...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	HEO SUNGYOUNG, KIM GOEUN, CHOI HYUNSUK, KIM JONGBO, PARK BYOUNGGYU, SON KIDOC, LEE HYUCKKI, KWON YONGDUK, KIM YOUNGCHUN, SONG YURIM, SONG KYUNGHWAN, KIM INKYU
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	ADHESIVES APPARATUS THEREFOR CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY DYES ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS PAINTS POLISHES PRINTED CIRCUITS PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	According to various embodiments of the present disclosure, a method for implementing structural color comprises: an operation of forming an oxide layer on at least a portion of the surface of a metal substrate; an operation of coloring the oxide layer with a designated color and then sealing it; and an operation of etching at least a portion of the surface of the oxide layer. The etching operation may include immersing the metal substrate in a mixed solution of phosphoric acid and sulfuric acid. In addition, various embodiments are possible. 본 개시의 다양한 실시예에 따르면, 구조색을 구현하는 방법은, 금속 기판(metal substrate) 표면의 적어도 일부에 산화막(oxide layer)을 형성하는 동작, 지정된 색상으로 상기 산화막을 착색한 후, 봉공하는 동작, 및 상기 산화막 표면의 적어도 일부를 에칭하는 동작을 포함하고, 상기 에칭하는 동작은, 상기 금속 기판을 인산과 황산 혼합 용액에 침적시키는 동작을 포함할 수 있다. 이외에도 다양한 실시예가 가능하다.