HIGH-PRECISION SUBSTRATE POLISHING SYSTEM

A substrate polishing system according to one embodiment includes: a platen on which a polishing pad is mounted and which is rotatable; a substrate carrier which holds a substrate and is rotatable on an upper side of the platen; an infrared sensor located inside the platen to measure the temperature...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	YANG KI HYUK, WOO SANG JEONG
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS COLORIMETRY DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT,POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRA-RED,VISIBLE OR ULTRA-VIOLET LIGHT MEASURING PERFORMING OPERATIONS PHYSICS POLISHING RADIATION PYROMETRY SEMICONDUCTOR DEVICES TESTING TRANSPORTING
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Beschreibung
Zusammenfassung:	A substrate polishing system according to one embodiment includes: a platen on which a polishing pad is mounted and which is rotatable; a substrate carrier which holds a substrate and is rotatable on an upper side of the platen; an infrared sensor located inside the platen to measure the temperature of the substrate; and a control unit which determines the polishing state of the substrate using the measured value of the infrared sensor. 일 실시 예에 따른 기판 연마 장치는, 연마 패드가 안착되고, 회전 가능한 플레이튼; 기판을 파지하고, 상기 플레이튼의 상측에서 회전 가능한 기판 캐리어; 상기 플레이튼의 내부에 위치되어 상기 기판의 온도를 측정하는 적외선 센서; 및 상기 적외선 센서의 측정값을 이용하여 상기 기판의 연마 상태를 판단하는 제어부를 포함할 수 있다.