ENCLOSER CASE FOR MICROSPEAKER MODULE

According to one aspect of an embodiment, provided is an enclosure case for a microspeaker module comprising: a case main body that surrounds a microspeaker and equipped with a seating part therein wherein the microspeaker is seated; a control board assembled on an upper side of the case main body a...

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Bibliographische Detailangaben
Hauptverfasser:	JUNG SUNG CHUL, HA JONG HEON, HA JEONG AE
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	DEAF-AID SETS ELECTRIC COMMUNICATION TECHNIQUE ELECTRICITY LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKEACOUSTIC ELECTROMECHANICAL TRANSDUCERS PUBLIC ADDRESS SYSTEMS
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Beschreibung
Zusammenfassung:	According to one aspect of an embodiment, provided is an enclosure case for a microspeaker module comprising: a case main body that surrounds a microspeaker and equipped with a seating part therein wherein the microspeaker is seated; a control board assembled on an upper side of the case main body and applying an electric signal to the microspeaker; and a resonance space formed between the microspeaker, the case main body, and the control board. Therefore, the present invention is capable of having an advantage wherein a thickness of the microspeaker module can be configured to be thin. 실시예의 일 측면에 따르면, 마이크로스피커를 감싸고, 상기 마이크로스피커가 안착되는 안착부가 내부에 구비된 케이스 본체; 상기 케이스 본체의 상측에 조립되고, 상기 마이크로스피커에 전기 신호를 인가하는 제어 보드; 및 상기 마이크로스피커와 상기 케이스 본체 및 상기 제어 보드 사이에 형성되는 공명 공간;을 포함하는 마이크로스피커 모듈용 인클로져 케이스를 제공한다.