SYSTEMS AND METHODS FOR CONTROLLING VAPOR PHASE PROCESSING

A semiconductor processing device can include a reactor assembly including a reaction chamber sized to receive a substrate therein. An exhaust line is in fluid communication with the reaction chamber and is configured to deliver gases out of the reaction chamber. A valve may be disposed along the ex...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	LI CHEUK, SCHULTZ MICHAEL F, WINKLER JERELD LEE, SHUGRUE JOHN KEVIN
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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