Flexible Copper Clad Laminate and Flexible Printed Circuit Board

The present invention relates to a flexible copper clad laminate (FCCL) used in an electronic board such as a flexible circuit board, and a flexible printed circuit board (FPCB) comprising the same. The flexible copper clad laminate for the electronic board according to the present invention compris...

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Bibliographische Detailangaben
Hauptverfasser:	BACK SEUNGYONG, KIM EONJOONG, YOO MUSANG, LEE BYEUNGJU, CHUNG YOUNGBAE
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	The present invention relates to a flexible copper clad laminate (FCCL) used in an electronic board such as a flexible circuit board, and a flexible printed circuit board (FPCB) comprising the same. The flexible copper clad laminate for the electronic board according to the present invention comprises: a flexible base film layer; a fluorine-based composite material layer formed on at least one surface of the base film layer; and a conductive layer disposed on the fluorine-based composite material layer. Therefore, the present invention is capable of reducing dielectric loss. 본 발명은 연성회로기판과 같은 전자기판에 사용되는 연성동박적층판(FCCL : Flexible Copper Clad Laminate), 및 이를 포함하는 연성인쇄회로기판(FPCB : Flexible Printed Circuit Board)에 관한 것이다. 본 발명에 따른 전자기판용 연성동박적층판은, 유연한 기재 필름층, 기재 필름층의 적어도 한 면에 형성된 불소계 복합소재층 및 불소계 복합소재층 상에 배치된 도전층을 포함한다.