POLYIMIDE-BASED RESIN FILM SUBSTRATE FOR DISPLAY DEVICE SUBSTRATE FOR TOUCH PANEL SUBSTRATE FOR SOLAR CELL OPTICAL DEVICE AND ELECTRONIC DEVICE USING THE SAME

The present invention relates to a polyimide-based resin film, which contains a polyimide-based resin and a phosphine oxide-based compound represented by a chemical formula 1, has the yellow index measured on specimens with a thickness of 9.5 to 10.5 ㎛ of 20 or less, the glass transition temperature...

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Bibliographische Detailangaben
Hauptverfasser:	PARK HANGAH, KANG MI EUN, JO JUNG HO, PARK CHAN HYO, HAN SEUNG JIN, KIM SU KYEONG, HONG YE JI, LEE MIN WOOK, PARK JINYOUNG, PARK HYE JIN, KIM SEONGKU, AN KWANG HYEON, PARK CHAE WON
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS GENERAL PROCESSES OF COMPOUNDING MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS WORKING-UP
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Beschreibung
Zusammenfassung:	The present invention relates to a polyimide-based resin film, which contains a polyimide-based resin and a phosphine oxide-based compound represented by a chemical formula 1, has the yellow index measured on specimens with a thickness of 9.5 to 10.5 ㎛ of 20 or less, the glass transition temperature of 430℃ or more, the transmittance for a wavelength of 450 nm of 75% or more, and the thermal expansion coefficient of 20 ppm/℃ or less measured while raising the temperature at a temperature range of 100 to 300℃, and tensile modulus of 8 GPa or more according to ASTM D638 Type V, and a substrate for a display device, a substrate for a touch panel, a substrate for a solar cell, an optical device and an electronic device using the same. 본 발명은 폴리이미드계 수지 및 화학식1로 표시되는 포스핀 옥사이드계 화합물을 포함하고, 9.5 ㎛ 내지 10.5 ㎛의 두께를 갖는 시편에 대해 측정한 황색지수가 20 이하이고, 유리전이온도가 430 ℃ 이상이고, 450 nm 파장에 대한 투과도가 75% 이상이고, 100 ℃ 내지 300 ℃ 온도 범위에서 승온하며 측정한 열팽창계수가 20 ppm/℃ 이하이고, ASTM D638 Type V에 의한 인장탄성율이 8 GPa 이상인, 폴리이미드계 수지 필름 및 이를 이용한 디스플레이 장치용 기판, 터치패널용 기판, 태양전지용 기판, 광학 장치 및 전자 장치에 관한 것이다.