열경화성 수지 조성물, 프리프레그, 적층판, 금속 피복적층판, 프린트 배선판 및 고속 통신 대응 모듈
(a) 적어도 1개의 N-치환 말레이미드기를 갖는 말레이미드 화합물, 및 (b) 하기 일반식 (1)로 표시되고, 또한 상기 (a) 성분이 갖는 말레이미드기에 대하여 반응성을 나타내지 않는 화합물을 함유하여 이루어지는 열경화성 수지 조성물. JPEGpct00043.jpg3081 (Xb1은, 단결합 또는 치환 혹은 비치환의 탄소수 1 내지 5의 지방족 탄화수소기를 나타낸다. Rb1 및 Rb2는, 각각 독립적으로, 치환 혹은 비치환의 탄소수 1 내지 10의 지방족 탄화수소기, 치환 혹은 비치환의 환 형성 탄소수 6 내지 18의 방향족 탄...
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| description | (a) 적어도 1개의 N-치환 말레이미드기를 갖는 말레이미드 화합물, 및 (b) 하기 일반식 (1)로 표시되고, 또한 상기 (a) 성분이 갖는 말레이미드기에 대하여 반응성을 나타내지 않는 화합물을 함유하여 이루어지는 열경화성 수지 조성물. JPEGpct00043.jpg3081 (Xb1은, 단결합 또는 치환 혹은 비치환의 탄소수 1 내지 5의 지방족 탄화수소기를 나타낸다. Rb1 및 Rb2는, 각각 독립적으로, 치환 혹은 비치환의 탄소수 1 내지 10의 지방족 탄화수소기, 치환 혹은 비치환의 환 형성 탄소수 6 내지 18의 방향족 탄화수소기, 치환 혹은 비치환의 환 형성 원자수 5 내지 20의 복소환식 방향족 탄화수소기, 산소 원자 함유기, 또는 그것들의 조합을 포함하는 기를 나타낸다. m 및 n은, 각각 독립적으로, 0 내지 5의 정수이다.)
A thermosetting resin composition containing a maleimide compound (a) having at least one N-substituted maleimide group, and a compound (b) represented by the following general formula (1) exhibiting no reactivity with the maleimide group of the component (a) (Xb1 represents a single bond or a substituted or unsubstituted aliphatic hydrocarbon group having 1 to 5 carbon atoms; Rb1 and Rb2 each independently represent a substituted or unsubstituted aliphatic hydrocarbon group having 1 to 10 carbon atoms, a substituted or unsubstituted aromatic hydrocarbon group having 6 to 18 ring carbon atoms, a substituted or unsubstituted heterocyclic aromatic hydrocarbon group having 5 to 20 ring atoms, an oxygen atom-containing group, or a group containing a combination of these groups; and m and n each independently represent an integer of 0 to 5). |
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| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_KR20230129430A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>KR20230129430A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_KR20230129430A3</originalsourceid><addsrcrecordid>eNrjZGh7M33Lq017386c8qZlo8KbjhlvljcovFm4Ach7vWaPjsLbKS2vl60BkQs6Xm3foaPwZkHjmx1b3_ZM0FF4taPjTVsvUMme15u3IomD9Wx427VD4fUGoEELgIJAVr_Cq80LwOrbtr7pXqDwuqfhzdyJCq9XrXg9uYOHgTUtMac4lRdKczMou7mGOHvophbkx6cWFyQmp-allsR7BxkZGBkbGBpZmhgbOBoTpwoAD5FwRA</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>열경화성 수지 조성물, 프리프레그, 적층판, 금속 피복적층판, 프린트 배선판 및 고속 통신 대응 모듈</title><source>esp@cenet</source><creator>TSUCHIKAWA SHINJI ; MORITA KOJI ; SHIMOKAWA RYO ; HAYASHI CHIHIRO ; IWASAKI TOMIO ; KASUGA KEIICHI</creator><creatorcontrib>TSUCHIKAWA SHINJI ; MORITA KOJI ; SHIMOKAWA RYO ; HAYASHI CHIHIRO ; IWASAKI TOMIO ; KASUGA KEIICHI</creatorcontrib><description>(a) 적어도 1개의 N-치환 말레이미드기를 갖는 말레이미드 화합물, 및 (b) 하기 일반식 (1)로 표시되고, 또한 상기 (a) 성분이 갖는 말레이미드기에 대하여 반응성을 나타내지 않는 화합물을 함유하여 이루어지는 열경화성 수지 조성물. JPEGpct00043.jpg3081 (Xb1은, 단결합 또는 치환 혹은 비치환의 탄소수 1 내지 5의 지방족 탄화수소기를 나타낸다. Rb1 및 Rb2는, 각각 독립적으로, 치환 혹은 비치환의 탄소수 1 내지 10의 지방족 탄화수소기, 치환 혹은 비치환의 환 형성 탄소수 6 내지 18의 방향족 탄화수소기, 치환 혹은 비치환의 환 형성 원자수 5 내지 20의 복소환식 방향족 탄화수소기, 산소 원자 함유기, 또는 그것들의 조합을 포함하는 기를 나타낸다. m 및 n은, 각각 독립적으로, 0 내지 5의 정수이다.)
A thermosetting resin composition containing a maleimide compound (a) having at least one N-substituted maleimide group, and a compound (b) represented by the following general formula (1) exhibiting no reactivity with the maleimide group of the component (a) (Xb1 represents a single bond or a substituted or unsubstituted aliphatic hydrocarbon group having 1 to 5 carbon atoms; Rb1 and Rb2 each independently represent a substituted or unsubstituted aliphatic hydrocarbon group having 1 to 10 carbon atoms, a substituted or unsubstituted aromatic hydrocarbon group having 6 to 18 ring carbon atoms, a substituted or unsubstituted heterocyclic aromatic hydrocarbon group having 5 to 20 ring atoms, an oxygen atom-containing group, or a group containing a combination of these groups; and m and n each independently represent an integer of 0 to 5).</description><language>kor</language><subject>AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CHEMISTRY ; COMPOSITIONS BASED THEREON ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; GENERAL PROCESSES OF COMPOUNDING ; LAYERED PRODUCTS ; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM ; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; METALLURGY ; ORGANIC MACROMOLECULAR COMPOUNDS ; PERFORMING OPERATIONS ; PRINTED CIRCUITS ; THEIR PREPARATION OR CHEMICAL WORKING-UP ; TRANSPORTING ; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS ; WORKING-UP</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230908&DB=EPODOC&CC=KR&NR=20230129430A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,777,882,25545,76296</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230908&DB=EPODOC&CC=KR&NR=20230129430A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>TSUCHIKAWA SHINJI</creatorcontrib><creatorcontrib>MORITA KOJI</creatorcontrib><creatorcontrib>SHIMOKAWA RYO</creatorcontrib><creatorcontrib>HAYASHI CHIHIRO</creatorcontrib><creatorcontrib>IWASAKI TOMIO</creatorcontrib><creatorcontrib>KASUGA KEIICHI</creatorcontrib><title>열경화성 수지 조성물, 프리프레그, 적층판, 금속 피복적층판, 프린트 배선판 및 고속 통신 대응 모듈</title><description>(a) 적어도 1개의 N-치환 말레이미드기를 갖는 말레이미드 화합물, 및 (b) 하기 일반식 (1)로 표시되고, 또한 상기 (a) 성분이 갖는 말레이미드기에 대하여 반응성을 나타내지 않는 화합물을 함유하여 이루어지는 열경화성 수지 조성물. JPEGpct00043.jpg3081 (Xb1은, 단결합 또는 치환 혹은 비치환의 탄소수 1 내지 5의 지방족 탄화수소기를 나타낸다. Rb1 및 Rb2는, 각각 독립적으로, 치환 혹은 비치환의 탄소수 1 내지 10의 지방족 탄화수소기, 치환 혹은 비치환의 환 형성 탄소수 6 내지 18의 방향족 탄화수소기, 치환 혹은 비치환의 환 형성 원자수 5 내지 20의 복소환식 방향족 탄화수소기, 산소 원자 함유기, 또는 그것들의 조합을 포함하는 기를 나타낸다. m 및 n은, 각각 독립적으로, 0 내지 5의 정수이다.)
A thermosetting resin composition containing a maleimide compound (a) having at least one N-substituted maleimide group, and a compound (b) represented by the following general formula (1) exhibiting no reactivity with the maleimide group of the component (a) (Xb1 represents a single bond or a substituted or unsubstituted aliphatic hydrocarbon group having 1 to 5 carbon atoms; Rb1 and Rb2 each independently represent a substituted or unsubstituted aliphatic hydrocarbon group having 1 to 10 carbon atoms, a substituted or unsubstituted aromatic hydrocarbon group having 6 to 18 ring carbon atoms, a substituted or unsubstituted heterocyclic aromatic hydrocarbon group having 5 to 20 ring atoms, an oxygen atom-containing group, or a group containing a combination of these groups; and m and n each independently represent an integer of 0 to 5).</description><subject>AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CHEMISTRY</subject><subject>COMPOSITIONS BASED THEREON</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>GENERAL PROCESSES OF COMPOUNDING</subject><subject>LAYERED PRODUCTS</subject><subject>LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM</subject><subject>MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>METALLURGY</subject><subject>ORGANIC MACROMOLECULAR COMPOUNDS</subject><subject>PERFORMING OPERATIONS</subject><subject>PRINTED CIRCUITS</subject><subject>THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><subject>TRANSPORTING</subject><subject>USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS</subject><subject>WORKING-UP</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZGh7M33Lq017386c8qZlo8KbjhlvljcovFm4Ach7vWaPjsLbKS2vl60BkQs6Xm3foaPwZkHjmx1b3_ZM0FF4taPjTVsvUMme15u3IomD9Wx427VD4fUGoEELgIJAVr_Cq80LwOrbtr7pXqDwuqfhzdyJCq9XrXg9uYOHgTUtMac4lRdKczMou7mGOHvophbkx6cWFyQmp-allsR7BxkZGBkbGBpZmhgbOBoTpwoAD5FwRA</recordid><startdate>20230908</startdate><enddate>20230908</enddate><creator>TSUCHIKAWA SHINJI</creator><creator>MORITA KOJI</creator><creator>SHIMOKAWA RYO</creator><creator>HAYASHI CHIHIRO</creator><creator>IWASAKI TOMIO</creator><creator>KASUGA KEIICHI</creator><scope>EVB</scope></search><sort><creationdate>20230908</creationdate><title>열경화성 수지 조성물, 프리프레그, 적층판, 금속 피복적층판, 프린트 배선판 및 고속 통신 대응 모듈</title><author>TSUCHIKAWA SHINJI ; MORITA KOJI ; SHIMOKAWA RYO ; HAYASHI CHIHIRO ; IWASAKI TOMIO ; KASUGA KEIICHI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_KR20230129430A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>kor</language><creationdate>2023</creationdate><topic>AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CHEMISTRY</topic><topic>COMPOSITIONS BASED THEREON</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>GENERAL PROCESSES OF COMPOUNDING</topic><topic>LAYERED PRODUCTS</topic><topic>LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM</topic><topic>MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>METALLURGY</topic><topic>ORGANIC MACROMOLECULAR COMPOUNDS</topic><topic>PERFORMING OPERATIONS</topic><topic>PRINTED CIRCUITS</topic><topic>THEIR PREPARATION OR CHEMICAL WORKING-UP</topic><topic>TRANSPORTING</topic><topic>USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS</topic><topic>WORKING-UP</topic><toplevel>online_resources</toplevel><creatorcontrib>TSUCHIKAWA SHINJI</creatorcontrib><creatorcontrib>MORITA KOJI</creatorcontrib><creatorcontrib>SHIMOKAWA RYO</creatorcontrib><creatorcontrib>HAYASHI CHIHIRO</creatorcontrib><creatorcontrib>IWASAKI TOMIO</creatorcontrib><creatorcontrib>KASUGA KEIICHI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>TSUCHIKAWA SHINJI</au><au>MORITA KOJI</au><au>SHIMOKAWA RYO</au><au>HAYASHI CHIHIRO</au><au>IWASAKI TOMIO</au><au>KASUGA KEIICHI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>열경화성 수지 조성물, 프리프레그, 적층판, 금속 피복적층판, 프린트 배선판 및 고속 통신 대응 모듈</title><date>2023-09-08</date><risdate>2023</risdate><abstract>(a) 적어도 1개의 N-치환 말레이미드기를 갖는 말레이미드 화합물, 및 (b) 하기 일반식 (1)로 표시되고, 또한 상기 (a) 성분이 갖는 말레이미드기에 대하여 반응성을 나타내지 않는 화합물을 함유하여 이루어지는 열경화성 수지 조성물. JPEGpct00043.jpg3081 (Xb1은, 단결합 또는 치환 혹은 비치환의 탄소수 1 내지 5의 지방족 탄화수소기를 나타낸다. Rb1 및 Rb2는, 각각 독립적으로, 치환 혹은 비치환의 탄소수 1 내지 10의 지방족 탄화수소기, 치환 혹은 비치환의 환 형성 탄소수 6 내지 18의 방향족 탄화수소기, 치환 혹은 비치환의 환 형성 원자수 5 내지 20의 복소환식 방향족 탄화수소기, 산소 원자 함유기, 또는 그것들의 조합을 포함하는 기를 나타낸다. m 및 n은, 각각 독립적으로, 0 내지 5의 정수이다.)
A thermosetting resin composition containing a maleimide compound (a) having at least one N-substituted maleimide group, and a compound (b) represented by the following general formula (1) exhibiting no reactivity with the maleimide group of the component (a) (Xb1 represents a single bond or a substituted or unsubstituted aliphatic hydrocarbon group having 1 to 5 carbon atoms; Rb1 and Rb2 each independently represent a substituted or unsubstituted aliphatic hydrocarbon group having 1 to 10 carbon atoms, a substituted or unsubstituted aromatic hydrocarbon group having 6 to 18 ring carbon atoms, a substituted or unsubstituted heterocyclic aromatic hydrocarbon group having 5 to 20 ring atoms, an oxygen atom-containing group, or a group containing a combination of these groups; and m and n each independently represent an integer of 0 to 5).</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL PROCESSES OF COMPOUNDING LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS PRINTED CIRCUITS THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS WORKING-UP |
| title | 열경화성 수지 조성물, 프리프레그, 적층판, 금속 피복적층판, 프린트 배선판 및 고속 통신 대응 모듈 |
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