Metal substrate and Mask using the same
An embodiment of the present invention relates to a metal substrate and a mask for deposition that maximizes deposition efficiency using and implementing the same, so as to provide the metal substrate and the mask for deposition equipped with a torsion index (Hr) that can minimize a torsion phenomen...
Gespeichert in:
Hauptverfasser: | , , , , , , , , , |
---|---|
Format: | Patent |
Sprache: | eng ; kor |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
container_end_page | |
---|---|
container_issue | |
container_start_page | |
container_title | |
container_volume | |
creator | LIM JEONG RYONG MOON BYUNG YOUL ROH GEON HO KIM NAM HO LEE SANG BEUM PARK JAE SEOK CHO SU HYEON HWANG JOO HYUN SON HYO WON HAN TAE HOON |
description | An embodiment of the present invention relates to a metal substrate and a mask for deposition that maximizes deposition efficiency using and implementing the same, so as to provide the metal substrate and the mask for deposition equipped with a torsion index (Hr) that can minimize a torsion phenomenon that occurs when etching a metal substrate to manufacture the mask for deposition. The mask for deposition comprises a metal plate comprising a first surface and a second surface opposite to the first surface.
본 발명의 실시예는 금속기판과 이를 이용하여 구현하는 증착효율성을 극대화한 증찰용마스크에 대한 것으로, 증착용 마스크로 제조하기 위해 금속기판을 에칭하는 경우 발생하는 비틀림 현상을 최소화할 수 있는 비틀림 지수(Hr)를 구비한 금속기판과 증착용마스크를 제공할 수 있도록 한다. |
format | Patent |
fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_KR20230129337A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>KR20230129337A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_KR20230129337A3</originalsourceid><addsrcrecordid>eNrjZFD3TS1JzFEoLk0qLilKLElVSMxLUfBNLM5WKC3OzEtXKMlIVShOzE3lYWBNS8wpTuWF0twMym6uIc4euqkF-fGpxQWJyal5qSXx3kFGBkbGBoZGlsbG5o7GxKkCAAjvKEY</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Metal substrate and Mask using the same</title><source>esp@cenet</source><creator>LIM JEONG RYONG ; MOON BYUNG YOUL ; ROH GEON HO ; KIM NAM HO ; LEE SANG BEUM ; PARK JAE SEOK ; CHO SU HYEON ; HWANG JOO HYUN ; SON HYO WON ; HAN TAE HOON</creator><creatorcontrib>LIM JEONG RYONG ; MOON BYUNG YOUL ; ROH GEON HO ; KIM NAM HO ; LEE SANG BEUM ; PARK JAE SEOK ; CHO SU HYEON ; HWANG JOO HYUN ; SON HYO WON ; HAN TAE HOON</creatorcontrib><description>An embodiment of the present invention relates to a metal substrate and a mask for deposition that maximizes deposition efficiency using and implementing the same, so as to provide the metal substrate and the mask for deposition equipped with a torsion index (Hr) that can minimize a torsion phenomenon that occurs when etching a metal substrate to manufacture the mask for deposition. The mask for deposition comprises a metal plate comprising a first surface and a second surface opposite to the first surface.
본 발명의 실시예는 금속기판과 이를 이용하여 구현하는 증착효율성을 극대화한 증찰용마스크에 대한 것으로, 증착용 마스크로 제조하기 위해 금속기판을 에칭하는 경우 발생하는 비틀림 현상을 최소화할 수 있는 비틀림 지수(Hr)를 구비한 금속기판과 증착용마스크를 제공할 수 있도록 한다.</description><language>eng ; kor</language><subject>CHEMICAL SURFACE TREATMENT ; CHEMISTRY ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING MATERIAL WITH METALLIC MATERIAL ; COATING METALLIC MATERIAL ; DIFFUSION TREATMENT OF METALLIC MATERIAL ; ELECTRICITY ; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL ; METALLURGY ; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230908&DB=EPODOC&CC=KR&NR=20230129337A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230908&DB=EPODOC&CC=KR&NR=20230129337A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>LIM JEONG RYONG</creatorcontrib><creatorcontrib>MOON BYUNG YOUL</creatorcontrib><creatorcontrib>ROH GEON HO</creatorcontrib><creatorcontrib>KIM NAM HO</creatorcontrib><creatorcontrib>LEE SANG BEUM</creatorcontrib><creatorcontrib>PARK JAE SEOK</creatorcontrib><creatorcontrib>CHO SU HYEON</creatorcontrib><creatorcontrib>HWANG JOO HYUN</creatorcontrib><creatorcontrib>SON HYO WON</creatorcontrib><creatorcontrib>HAN TAE HOON</creatorcontrib><title>Metal substrate and Mask using the same</title><description>An embodiment of the present invention relates to a metal substrate and a mask for deposition that maximizes deposition efficiency using and implementing the same, so as to provide the metal substrate and the mask for deposition equipped with a torsion index (Hr) that can minimize a torsion phenomenon that occurs when etching a metal substrate to manufacture the mask for deposition. The mask for deposition comprises a metal plate comprising a first surface and a second surface opposite to the first surface.
본 발명의 실시예는 금속기판과 이를 이용하여 구현하는 증착효율성을 극대화한 증찰용마스크에 대한 것으로, 증착용 마스크로 제조하기 위해 금속기판을 에칭하는 경우 발생하는 비틀림 현상을 최소화할 수 있는 비틀림 지수(Hr)를 구비한 금속기판과 증착용마스크를 제공할 수 있도록 한다.</description><subject>CHEMICAL SURFACE TREATMENT</subject><subject>CHEMISTRY</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING MATERIAL WITH METALLIC MATERIAL</subject><subject>COATING METALLIC MATERIAL</subject><subject>DIFFUSION TREATMENT OF METALLIC MATERIAL</subject><subject>ELECTRICITY</subject><subject>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</subject><subject>METALLURGY</subject><subject>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZFD3TS1JzFEoLk0qLilKLElVSMxLUfBNLM5WKC3OzEtXKMlIVShOzE3lYWBNS8wpTuWF0twMym6uIc4euqkF-fGpxQWJyal5qSXx3kFGBkbGBoZGlsbG5o7GxKkCAAjvKEY</recordid><startdate>20230908</startdate><enddate>20230908</enddate><creator>LIM JEONG RYONG</creator><creator>MOON BYUNG YOUL</creator><creator>ROH GEON HO</creator><creator>KIM NAM HO</creator><creator>LEE SANG BEUM</creator><creator>PARK JAE SEOK</creator><creator>CHO SU HYEON</creator><creator>HWANG JOO HYUN</creator><creator>SON HYO WON</creator><creator>HAN TAE HOON</creator><scope>EVB</scope></search><sort><creationdate>20230908</creationdate><title>Metal substrate and Mask using the same</title><author>LIM JEONG RYONG ; MOON BYUNG YOUL ; ROH GEON HO ; KIM NAM HO ; LEE SANG BEUM ; PARK JAE SEOK ; CHO SU HYEON ; HWANG JOO HYUN ; SON HYO WON ; HAN TAE HOON</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_KR20230129337A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; kor</language><creationdate>2023</creationdate><topic>CHEMICAL SURFACE TREATMENT</topic><topic>CHEMISTRY</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING MATERIAL WITH METALLIC MATERIAL</topic><topic>COATING METALLIC MATERIAL</topic><topic>DIFFUSION TREATMENT OF METALLIC MATERIAL</topic><topic>ELECTRICITY</topic><topic>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</topic><topic>METALLURGY</topic><topic>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</topic><toplevel>online_resources</toplevel><creatorcontrib>LIM JEONG RYONG</creatorcontrib><creatorcontrib>MOON BYUNG YOUL</creatorcontrib><creatorcontrib>ROH GEON HO</creatorcontrib><creatorcontrib>KIM NAM HO</creatorcontrib><creatorcontrib>LEE SANG BEUM</creatorcontrib><creatorcontrib>PARK JAE SEOK</creatorcontrib><creatorcontrib>CHO SU HYEON</creatorcontrib><creatorcontrib>HWANG JOO HYUN</creatorcontrib><creatorcontrib>SON HYO WON</creatorcontrib><creatorcontrib>HAN TAE HOON</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>LIM JEONG RYONG</au><au>MOON BYUNG YOUL</au><au>ROH GEON HO</au><au>KIM NAM HO</au><au>LEE SANG BEUM</au><au>PARK JAE SEOK</au><au>CHO SU HYEON</au><au>HWANG JOO HYUN</au><au>SON HYO WON</au><au>HAN TAE HOON</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Metal substrate and Mask using the same</title><date>2023-09-08</date><risdate>2023</risdate><abstract>An embodiment of the present invention relates to a metal substrate and a mask for deposition that maximizes deposition efficiency using and implementing the same, so as to provide the metal substrate and the mask for deposition equipped with a torsion index (Hr) that can minimize a torsion phenomenon that occurs when etching a metal substrate to manufacture the mask for deposition. The mask for deposition comprises a metal plate comprising a first surface and a second surface opposite to the first surface.
본 발명의 실시예는 금속기판과 이를 이용하여 구현하는 증착효율성을 극대화한 증찰용마스크에 대한 것으로, 증착용 마스크로 제조하기 위해 금속기판을 에칭하는 경우 발생하는 비틀림 현상을 최소화할 수 있는 비틀림 지수(Hr)를 구비한 금속기판과 증착용마스크를 제공할 수 있도록 한다.</abstract><oa>free_for_read</oa></addata></record> |
fulltext | fulltext_linktorsrc |
identifier | |
ispartof | |
issn | |
language | eng ; kor |
recordid | cdi_epo_espacenet_KR20230129337A |
source | esp@cenet |
subjects | CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION |
title | Metal substrate and Mask using the same |
url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-08T18%3A06%3A18IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=LIM%20JEONG%20RYONG&rft.date=2023-09-08&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EKR20230129337A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |