NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION INSULATING FILM AND SEMICONDUCTOR DEVICE MANUFACTURED USING THE SAME

The present invention relates to a negative photosensitive resin composition, an insulating film prepared using the same, and a semiconductor device. Specifically, according to one embodiment, the negative photosensitive resin composition for a fan-out package comprises: a polyimide precursor or res...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	BAE SHINHYO, KIM JIYU, KIM MINGYUM, BAEK TAEK JIN, KANG HEEKYOUNG, KIM SANG SOO, LEE DONGHWAN, HONG CHUNGBEUM, PARK INKEOL
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR CHEMISTRY CINEMATOGRAPHY COMPOSITIONS BASED THEREON ELECTROGRAPHY HOLOGRAPHY MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS MATERIALS THEREFOR METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS THEIR PREPARATION OR CHEMICAL WORKING-UP
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	The present invention relates to a negative photosensitive resin composition, an insulating film prepared using the same, and a semiconductor device. Specifically, according to one embodiment, the negative photosensitive resin composition for a fan-out package comprises: a polyimide precursor or resin; and citric acid, wherein the polyimide precursor or resin includes: a repeating unit represented by following chemical formula 1 and a repeating unit represented by following chemical formula 2. (In chemical formula 1 and 2, each substituent is the same as defined in the specification.) According to the present invention, it is possible to minimize solvent shock without leaving scum during a development process while having storage stability for more than 10 days at room temperature. 본 발명은 네거티브 감광성 수지 조성물, 이를 이용하여 제조된 절연막 및 반도체 디바이스에 관한 것이다. 구체적으로, 일 구현예는 팬 아웃 패키지용 네거티브 감광성 수지 조성물에 있어서, 폴리이미드 전구체 또는 수지; 및 시트르산을 포함하고, 상기 폴리이미드 전구체 또는 수지는 하기 화학식 1로 표시되는 반복 단위 및 하기 화학식 2로 표시되는 반복단위를 포함하는, 네거티브 감광성 수지 조성물을 제공한다: [화학식 1] TIFFpat00074.tif3675 [화학식 2] TIFFpat00075.tif3675 (상기 화학식 1 및 2에서, 각 치환기는 명세서에 정의된 바와 같다.)