필름상 접착제, 다이싱·다이본딩 일체형 필름, 및 반도체 장치 및 그 제조 방법
필름상 접착제가 개시된다. 필름상 접착제의 일 양태는, 금속 입자를 함유하고, 110℃에 있어서의 전단 점도가 30000Pa·s 이하이다. 필름상 접착제의 다른 양태는, 금속 입자를 함유하고, 110℃에 있어서의 손실 탄성률이 200kPa 이하이다. 필름상 접착제의 다른 양태는, 금속 입자와, 열경화성 수지와, 경화제와, 엘라스토머를 함유하고, 금속 입자, 열경화성 수지, 경화제, 및 엘라스토머의 합계량을 기준으로 하여, 금속 입자의 함유량이, 70.0질량% 이상이며, 열경화성 수지 및 경화제의 합계의 함유량이, 13.0질량% 이상...
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| creator | KAMONO MEGUMI KURODA TAKAHIRO TANIGUCHI KOHEI AKIYAMA YUYA ITAGAKI KEI HIRAMOTO YUYA |
| description | 필름상 접착제가 개시된다. 필름상 접착제의 일 양태는, 금속 입자를 함유하고, 110℃에 있어서의 전단 점도가 30000Pa·s 이하이다. 필름상 접착제의 다른 양태는, 금속 입자를 함유하고, 110℃에 있어서의 손실 탄성률이 200kPa 이하이다. 필름상 접착제의 다른 양태는, 금속 입자와, 열경화성 수지와, 경화제와, 엘라스토머를 함유하고, 금속 입자, 열경화성 수지, 경화제, 및 엘라스토머의 합계량을 기준으로 하여, 금속 입자의 함유량이, 70.0질량% 이상이며, 열경화성 수지 및 경화제의 합계의 함유량이, 13.0질량% 이상이다.
Disclosed is a film-shaped adhesive. An embodiment of the film-shaped adhesive contains metal particles and has a shear viscosity at 110° C. of 30000 Pa·s or less. Another embodiment of the film-shaped adhesive contains metal particles and has a loss modulus at 110° C. of 200 kPa or less. Another embodiment of the film-shaped adhesive contains metal particles, a thermosetting resin, a curing agent, and an elastomer, in which a content of the metal particles based on the total amount of the metal particles, thermosetting resin, curing agent, and elastomer is 70.0% by mass or more, and a total content of the thermosetting resin and the curing agent is 13.0% by mass or more. |
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Disclosed is a film-shaped adhesive. An embodiment of the film-shaped adhesive contains metal particles and has a shear viscosity at 110° C. of 30000 Pa·s or less. Another embodiment of the film-shaped adhesive contains metal particles and has a loss modulus at 110° C. of 200 kPa or less. Another embodiment of the film-shaped adhesive contains metal particles, a thermosetting resin, a curing agent, and an elastomer, in which a content of the metal particles based on the total amount of the metal particles, thermosetting resin, curing agent, and elastomer is 70.0% by mass or more, and a total content of the thermosetting resin and the curing agent is 13.0% by mass or more.</description><language>kor</language><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ; ADHESIVES ; BASIC ELECTRIC ELEMENTS ; CHEMISTRY ; COMPOSITIONS BASED THEREON ; DYES ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; METALLURGY ; MISCELLANEOUS APPLICATIONS OF MATERIALS ; MISCELLANEOUS COMPOSITIONS ; NATURAL RESINS ; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ; ORGANIC MACROMOLECULAR COMPOUNDS ; PAINTS ; POLISHES ; SEMICONDUCTOR DEVICES ; THEIR PREPARATION OR CHEMICAL WORKING-UP ; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS ; USE OF MATERIALS AS ADHESIVES</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230822&DB=EPODOC&CC=KR&NR=20230122601A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25562,76317</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230822&DB=EPODOC&CC=KR&NR=20230122601A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KAMONO MEGUMI</creatorcontrib><creatorcontrib>KURODA TAKAHIRO</creatorcontrib><creatorcontrib>TANIGUCHI KOHEI</creatorcontrib><creatorcontrib>AKIYAMA YUYA</creatorcontrib><creatorcontrib>ITAGAKI KEI</creatorcontrib><creatorcontrib>HIRAMOTO YUYA</creatorcontrib><title>필름상 접착제, 다이싱·다이본딩 일체형 필름, 및 반도체 장치 및 그 제조 방법</title><description>필름상 접착제가 개시된다. 필름상 접착제의 일 양태는, 금속 입자를 함유하고, 110℃에 있어서의 전단 점도가 30000Pa·s 이하이다. 필름상 접착제의 다른 양태는, 금속 입자를 함유하고, 110℃에 있어서의 손실 탄성률이 200kPa 이하이다. 필름상 접착제의 다른 양태는, 금속 입자와, 열경화성 수지와, 경화제와, 엘라스토머를 함유하고, 금속 입자, 열경화성 수지, 경화제, 및 엘라스토머의 합계량을 기준으로 하여, 금속 입자의 함유량이, 70.0질량% 이상이며, 열경화성 수지 및 경화제의 합계의 함유량이, 13.0질량% 이상이다.
Disclosed is a film-shaped adhesive. An embodiment of the film-shaped adhesive contains metal particles and has a shear viscosity at 110° C. of 30000 Pa·s or less. Another embodiment of the film-shaped adhesive contains metal particles and has a loss modulus at 110° C. of 200 kPa or less. Another embodiment of the film-shaped adhesive contains metal particles, a thermosetting resin, a curing agent, and an elastomer, in which a content of the metal particles based on the total amount of the metal particles, thermosetting resin, curing agent, and elastomer is 70.0% by mass or more, and a total content of the thermosetting resin and the curing agent is 13.0% by mass or more.</description><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE</subject><subject>ADHESIVES</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CHEMISTRY</subject><subject>COMPOSITIONS BASED THEREON</subject><subject>DYES</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>METALLURGY</subject><subject>MISCELLANEOUS APPLICATIONS OF MATERIALS</subject><subject>MISCELLANEOUS COMPOSITIONS</subject><subject>NATURAL RESINS</subject><subject>NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL</subject><subject>ORGANIC MACROMOLECULAR COMPOUNDS</subject><subject>PAINTS</subject><subject>POLISHES</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><subject>USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS</subject><subject>USE OF MATERIALS AS ADHESIVES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZMh8O7Xl9bKWN82NCm8WTHyzYeWbBXN0FF53L3kzd8ub7o2HtkOYrzfveD1lpcKbuXvebNrydsZUBYg2oMoN_UA843V_C1BC4c28pW92zgALvtq-A2jinDcLNwC5K19vmsrDwJqWmFOcyguluRmU3VxDnD10Uwvy41OLCxKTU_NSS-K9g4wMjIwNDI2MzAwMHY2JUwUA1fZebw</recordid><startdate>20230822</startdate><enddate>20230822</enddate><creator>KAMONO MEGUMI</creator><creator>KURODA TAKAHIRO</creator><creator>TANIGUCHI KOHEI</creator><creator>AKIYAMA YUYA</creator><creator>ITAGAKI KEI</creator><creator>HIRAMOTO YUYA</creator><scope>EVB</scope></search><sort><creationdate>20230822</creationdate><title>필름상 접착제, 다이싱·다이본딩 일체형 필름, 및 반도체 장치 및 그 제조 방법</title><author>KAMONO MEGUMI ; KURODA TAKAHIRO ; TANIGUCHI KOHEI ; AKIYAMA YUYA ; ITAGAKI KEI ; HIRAMOTO YUYA</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_KR20230122601A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>kor</language><creationdate>2023</creationdate><topic>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE</topic><topic>ADHESIVES</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CHEMISTRY</topic><topic>COMPOSITIONS BASED THEREON</topic><topic>DYES</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>METALLURGY</topic><topic>MISCELLANEOUS APPLICATIONS OF MATERIALS</topic><topic>MISCELLANEOUS COMPOSITIONS</topic><topic>NATURAL RESINS</topic><topic>NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL</topic><topic>ORGANIC MACROMOLECULAR COMPOUNDS</topic><topic>PAINTS</topic><topic>POLISHES</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>THEIR PREPARATION OR CHEMICAL WORKING-UP</topic><topic>USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS</topic><topic>USE OF MATERIALS AS ADHESIVES</topic><toplevel>online_resources</toplevel><creatorcontrib>KAMONO MEGUMI</creatorcontrib><creatorcontrib>KURODA TAKAHIRO</creatorcontrib><creatorcontrib>TANIGUCHI KOHEI</creatorcontrib><creatorcontrib>AKIYAMA YUYA</creatorcontrib><creatorcontrib>ITAGAKI KEI</creatorcontrib><creatorcontrib>HIRAMOTO YUYA</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>KAMONO MEGUMI</au><au>KURODA TAKAHIRO</au><au>TANIGUCHI KOHEI</au><au>AKIYAMA YUYA</au><au>ITAGAKI KEI</au><au>HIRAMOTO YUYA</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>필름상 접착제, 다이싱·다이본딩 일체형 필름, 및 반도체 장치 및 그 제조 방법</title><date>2023-08-22</date><risdate>2023</risdate><abstract>필름상 접착제가 개시된다. 필름상 접착제의 일 양태는, 금속 입자를 함유하고, 110℃에 있어서의 전단 점도가 30000Pa·s 이하이다. 필름상 접착제의 다른 양태는, 금속 입자를 함유하고, 110℃에 있어서의 손실 탄성률이 200kPa 이하이다. 필름상 접착제의 다른 양태는, 금속 입자와, 열경화성 수지와, 경화제와, 엘라스토머를 함유하고, 금속 입자, 열경화성 수지, 경화제, 및 엘라스토머의 합계량을 기준으로 하여, 금속 입자의 함유량이, 70.0질량% 이상이며, 열경화성 수지 및 경화제의 합계의 함유량이, 13.0질량% 이상이다.
Disclosed is a film-shaped adhesive. An embodiment of the film-shaped adhesive contains metal particles and has a shear viscosity at 110° C. of 30000 Pa·s or less. Another embodiment of the film-shaped adhesive contains metal particles and has a loss modulus at 110° C. of 200 kPa or less. Another embodiment of the film-shaped adhesive contains metal particles, a thermosetting resin, a curing agent, and an elastomer, in which a content of the metal particles based on the total amount of the metal particles, thermosetting resin, curing agent, and elastomer is 70.0% by mass or more, and a total content of the thermosetting resin and the curing agent is 13.0% by mass or more.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS USE OF MATERIALS AS ADHESIVES |
| title | 필름상 접착제, 다이싱·다이본딩 일체형 필름, 및 반도체 장치 및 그 제조 방법 |
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