SUBSTRATE PROCESSING APPARATUS AND METHOD FOR CORRECTING POSITIONAL DISPLACEMENT

The present invention is to provide technology for suppressing positional displacement. A mounting plate is positioned by a first positioning instrument in a direction in which a processing container expands and contracts due to expansion and contraction according to temperature changes and is mount...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser:	KOBAYASHI TAMIHIRO
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	The present invention is to provide technology for suppressing positional displacement. A mounting plate is positioned by a first positioning instrument in a direction in which a processing container expands and contracts due to expansion and contraction according to temperature changes and is mounted on the processing container with respect to a predetermined reference position that serves as a standard for measuring positional displacement within the processing container. A mounting table is positioned in a position opposite to the position of the first positioning instrument with respect to the reference position by a second positioning instrument and is placed in the processing container via a support instrument mounted on the mounting plate. The substrate is mounted thereon. [과제] 위치 어긋남을 억제하는 기술을 제공하는 것. [해결 수단] 장착 플레이트는, 처리 용기 내의 위치 어긋남을 계측하는 기준이 되는 소정의 기준 위치에 대해서, 온도 변화에 의한 팽창, 수축에 의해 처리 용기가 신축하는 신축 방향으로 제 1 위치결정 기구에 의해 위치결정하여 처리 용기에 장착되어 있다. 탑재대는, 기준 위치에 대해서, 제 1 위치결정 기구의 위치의 반대측이 되는 위치에 제 2 위치결정 기구에 의해 위치결정하여 장착 플레이트에 장착된 지지 기구를 거쳐서 처리 용기 내에 배치되고, 기판이 탑재된다.