HOUSING FOR ELECTRONIC DEVICE AND ELECTRONIC DEVICE COMPRISING THE SAME

Disclosed are an electronic device housing and an electronic device comprising the same. According to various embodiments, the electronic device housing may comprise: a metal base; a plastic injection part formed on one area among a surface of the metal base; an oxide film layer formed on one area a...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	YOONHEE LEE, AEREE KIM, JOUNGKI PARK, SEUNGCHANG BAEK, JINHWAN JEONG, HANGYU HWANG, SUNGHO CHO, JUNCHEOL SHIN, JUNGHYUN IM
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	ALLOYS APPARATUS THEREFOR CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES FERROUS OR NON-FERROUS ALLOYS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY PRINTED CIRCUITS PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS TREATMENT OF ALLOYS OR NON-FERROUS METALS
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	Disclosed are an electronic device housing and an electronic device comprising the same. According to various embodiments, the electronic device housing may comprise: a metal base; a plastic injection part formed on one area among a surface of the metal base; an oxide film layer formed on one area among the surface of the metal base; a plating layer formed on one area among the surface of the metal base; and a deposition layer formed on the plating layer, wherein the oxide film layer and the plating layer may be formed to be spaced apart. Various embodiments are possible in addition thereto. Therefore, the present invention is capable of preventing and reducing appearance defects. 전자 장치 하우징 및 이를 포함하는 전자 장치가 개시된다. 다양한 실시 예에 따르면, 전자 장치 하우징은 금속 기재, 금속 기재의 표면 중 일 영역에 형성되는 플라스틱 사출부, 금속 기재의 표면 중 일 영역에 형성되는 산화피막층, 금속 기재의 표면 중 일 영역에 형성되는 도금층 및 도금층 상에 형성되는 증착층을 포함할 수 있고, 산화피막층 및 도금층은, 이격되어 형성될 수 있다. 그 외에도 다양한 실시 예들이 가능하다.