APPARATUS AND METHOD FOR PROCESSING SUBSTRATE

According to one embodiment of the present invention, a substrate processing apparatus comprises: a susceptor supporting a substrate; and a cover unit installed on an upper of the susceptor and placing the substrate on the upper part. The cover unit includes: a cover frame having one or more air gap...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	SUNG SE JONG, JANG WOONG JOO, JUNG WOO DUCK, JO JEONG HEE, HWANG RYONG, JUNG SANG SOON
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	According to one embodiment of the present invention, a substrate processing apparatus comprises: a susceptor supporting a substrate; and a cover unit installed on an upper of the susceptor and placing the substrate on the upper part. The cover unit includes: a cover frame having one or more air gaps; and one or more covers that have a shape corresponding to each air gap and can be mounted on each air gap. Therefore, process uniformity can be easily adjusted. 본 발명의 일 실시예에 의하면, 기판 처리 장치는, 기판을 지지하는 서셉터; 그리고 상기 서셉터의 상부에 설치되어 상부에 상기 기판이 놓여지는 커버 유닛을 포함하되, 상기 커버 유닛은, 하나 이상의 에어 갭을 가지는 커버프레임; 그리고 각각의 상기 에어 갭에 대응되는 형상을 가지고 각각의 상기 에어 갭에 실장가능한 하나 이상의 커버를 구비한다.